Ultrasonic Distance Measurement BoosterPack Reference Design
TIDA-00462
This product has been released to the market and is available for purchase. For some products, newer alternatives may be available.
This product has been released to the market and is available for purchase. For some products, newer alternatives may be available.
See the Important Notice and Disclaimer covering reference designs and other TI resources.
Key Document
- Ultrasonic Distance Measurement BoosterPack Design Guide (Rev. A)
(PDF 1057 KB)
29 Oct 2015
Description
The TIDA-00462 ultrasonic distance measurement reference design can measure the distance up to 99 inches with an accuracy of ±1.5 inches. The scope of this design guide is to give system designers a head-start in integrating TI’s industrial ultra-low-power MCU, analog signal conditioning, and power management technologies into their end-equipment systems. This design guide describes the principle of operation and basic design process for a low cost distance measuring system based on ultrasonic sound utilizing the MSP430 ultralow-power microcontroller. This design guide also addresses component selection, design theory, and test results of the TI Design system. All the relevant design files like Schematics, BOM, Layer plots, Altium files, Gerber and MSP430 MCU firmware are provided.
Features
- Ultrasonic technology
- Non-contact detection and measurement
- Maximum measurable distance: 99 inches
- Minimum measurable distance: 6 inches
- Maximum measured error less than 1.5 inches
- Current Consumption less than 1.8mA at 5V
- Simple, low cost, system-in-a-chip solution
See the Important Notice and Disclaimer covering reference designs and other TI resources.
