TIDA-00646

Matched Precision Temperature Sensing Reference Design for Heat Cost Allocators

TIDA-00646

Design files

Overview

The TIDA-00646 reference design demonstrates techniques for precision temperature sensing as required by heat cost llocators and other Internet of Things (IoT) applications. Heat cost allocators use the temperature differential between Room and Heater body to assign a share of the total cost of a central heating system among multiple users. TIDA-00646 achieves better than 0.5 degrees Celsius accuracy across a range of +20 to +85°C. The LMT70A CMOS sensors used in the design are available as matched pairs to eliminate the need for calibration during manufacturing, lowering OEM system cost. The design is compliant to the EN834 standard using the “two-sensor measurement method”.

Features
  • Highly accurate temperature sensing across environment conditions: better than 0.5 degrees from +20 to +85degC
  • Matching of two adjacent LMT70A sensors on Tape and Reel saves test and manufacturing cost
  • CC1310 SimpleLink(TM) wireless MCU provides single-chip solution for heat measurement and RF communications
  • Low power operation down to 2.0V extends battery lifetime
  • Cost-optimized two-layer PCB layout in HCA form factor
??image.gallery.download_en_US?? View video with transcript Video

A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUB32.PDF (2968 K)

Reference design overview and verified performance test data

TIDUAY7.PDF (1731 K)

Reference design overview and verified performance test data

TIDRJ75.PDF (465 K)

Detailed schematic diagram for design layout and components

TIDRJ86.PDF (98 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDRJ87.PDF (224 K)

Detailed overview of design layout for component placement

TIDRJ90.ZIP (986 K)

Files used for 3D models or 2D drawings of IC components

TIDCBJ4.ZIP (587 K)

Design file that contains information on physical board layer of design PCB

TIDRJ88.PDF (1150 K)

PCB layer plot file used for generating PCB design layout

TIDRJ89.PDF (2218 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

Analog temperature sensors

LMT70A±0.1°C Matching Accuracy Precision Analog Temperature Sensor

Data sheet: PDF | HTML
Sub-1 GHz wireless MCUs

CC1310SimpleLink™ 32-bit Arm Cortex-M3 Sub-1 GHz wireless MCU with 128kB Flash

Data sheet: PDF | HTML

Start development

Software

Firmware

TIDCBJ5 TIDA-00646 Firmware

Technical documentation

star
= Top documentation selected by TI
No results found. Please clear your search and try again.
View all 3
Type Title Date
* Design guide Matched Precision Temperature Sensing for Heat Cost Allocators Design Guide Nov. 18, 2015
Application note Wearable Temp-Sensing Layout Considerations Optimized for Thermal Response (Rev. B) Oct. 23, 2018
Design guide TIDA-00824 Test Results Oct. 21, 2015

Related design resources

Reference designs

REFERENCE DESIGN
TIDA-00824 Human Skin Temperature Sensing for Wearable Applications Reference Design TIDA-00838 Heat Cost Allocator with wM-Bus at 868 MHz Reference Design

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​

Videos