Automotive 1.3-MP camera module reference design with MIPI CSI-2 interface, PMIC, FPD-Link


Design files


This camera module reference design addresses the need for small low-cost cameras in automotive driver assistance systems (ADAS) by combining a 1.3-megapixel imager with integrated image signal processor (ISP) with a 12-bit, 100-MHz TI FPD-Link III serializer. Additionally, it provides a power-management integrated circuit (PMIC) power supply for both devices in an ultra-small form factor.

This design includes a high-speed serial interface to connect a remote automotive camera module to a display or machine vision processing system with a coaxial cable transmitting both data and power. The FPD-Link III SerDes technology used in this reference design enables the transmission of raw or processed video data, bidirectional control signals, and power over coax (POC) using a single cable.

  • Space-optimized design with integrated power supply that fits on a single 18 mm × 18 mm PCB
  • Integrated TPS650320-Q1 power supply includes three step-down converters and LDO to enable high efficiency and low noise supply generation
  • P2P compatible power supplies to enable functional safety applications
  • Enables camera applications up to 1 MP/60 fps using DS90UB933-Q1
  • 1.3-MP OX01F10 image sensor from Omnivision providing HDR YUV422, RGB888, RAW
  • Single Rosenberger Fakra coaxial connector for digital video, power, control, and diagnostics

A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUBF0.PDF (1664 K)

Reference design overview and verified performance test data

TIDM989.PDF (353 K)

Detailed schematic diagram for design layout and components

TIDM990.PDF (156 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDM991.PDF (271 K)

Detailed overview of design layout for component placement

TIDM993.ZIP (1177 K)

Files used for 3D models or 2D drawings of IC components

TIDCG36.ZIP (872 K)

Design file that contains information on physical board layer of design PCB

TIDM992.PDF (1501 K)

PCB layer plot file used for generating PCB design layout


Includes TI products in the design and potential alternatives.

FPD-Link SerDes

DS90UB933-Q112-bit 100 MHz FPD-Link III Serializer for 1MP/60fps and 2MP/30fps Cameras

Data sheet document-pdfAcrobat PDF

Technical documentation

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Type Title Date
* Design guide Automotive 1.3-MP Low-Cost Camera Module Ref Des|YUV422, PMIC, FPD-Link III, POC PDF | HTML Jan. 10, 2022

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