TIDM-INDUCTIVEPROX
MSP430 微控制器單晶片電感近距感測參考設計
TIDM-INDUCTIVEPROX
概覽
Historically, inductive sensing technique has required complex, analog-only circuitry, making it a costly technique for applications outside of industrial controls or portable metal detectors. To provide a low cost inductive sensing solution for designers, this reference design describes the implementation of the ultra-low power single chip solution for inductive proximity sensor by using TI Extended Scan Interface module on MSP430 microcontrollers. This reference design also uses three different LC sensors to demonstrate the compatibility of ESI module and calibration routine with different type and size of inductors
特點
- Ultra-Low Power
- Single Chip solution
- Non-contact detection
- Insensitive to Environmental Contaminations
- Compatible with different type and size of LC sensors
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The design resource accessed as www.ti.com/lit/zip/tidcbc0 or www.ti.com/lit/xx/tidcbc0a/tidcbc0a.zip has been migrated to a new user experience at www.ti.com/tool/download/TIDCBC0. Please update any bookmarks accordingly.
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| 類型 | 標題 | 下載最新的英文版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 設計指南 | Inductive Proximity Sensing Design Guide | 2015/9/10 | |||
| 技術文章 | Did you know inductive proximity sensing can be implemented with a single chip? | PDF | HTML | 2016/4/25 |