TLV2553EVM-PDK
TLV2553 11 通道低功耗序列 ADC 評估模組性能開發套件 (PDK)
TLV2553EVM-PDK
概覽
The TLV2553 evaluation module (EVM) performance development kit (PDK) is a platform for evaluating the TLV2553 successive approximation register (SAR) analog-to-digital converter (ADC).
The evaluation kit includes the TLV2553EVM, precision host interface (PHI) controller board, and computer software that enables the user to communicate with the ADC over a universal serial bus (USB), capture data, and perform data analysis.
特點
- Includes hardware and software required for diagnostic testing, as well as accurate performance evaluation of TLV2553 ADC
- No external power supply required
- Ships with PHI controller that provides a convenient interface to TLV2553EVM over USB 2.0 (or higher) for power delivery, as well as digital input/output
- Easy-to-use evaluation software for Windows® operating systems
- Software suite includes graphical tools for
- Multichannel data capture
- Output-code histogram generation and FFT analysis
- Provision for exporting data to text file for post processing
- TLV2553 evaluation board
- Precision host interface (PHI) controller board
精確 ADC
訂購並開始開發
開發板
TLV2553EVM-PDK — TLV2553 11 通道低功耗序列 ADC 評估模組性能開發套件 (PDK)
TLV2553EVM-PDK — TLV2553 11 通道低功耗序列 ADC 評估模組性能開發套件 (PDK)
開發模組 (EVM) 的 GUI
SLAC706 — TLV2553EVM-PDK Software GUI
支援產品和硬體
產品
精確 ADC
硬體開發
開發板
SLAC706 — TLV2553EVM-PDK Software GUI
產品
精確 ADC
硬體開發
開發板
版本資訊
The design resource accessed as www.ti.com/lit/zip/slac706 or www.ti.com/lit/xx/slac706/slac706.zip has been migrated to a new user experience at www.ti.com/tool/download/SLAC706. Please update any bookmarks accordingly.
開發模組 (EVM) 的 GUI
TLV2553EVM-PDK-GUI — TLV2553EVM-PDK GUI installer
支援產品和硬體
TLV2553EVM-PDK-GUI — TLV2553EVM-PDK GUI installer
GUI Installer
版本資訊
Evaluation GUI for the TLV2553EVM-PDK
技術文件
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TI 所選的重要文件
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檢視所有 2
| 類型 | 標題 | 下載最新的英文版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | EVM User's guide | TLV2553EVM-PDK User's Guide (Rev. A) | 2019/9/13 | |||
| 證書 | TLV2553EVM-PDK EU Declaration of Conformity (DoC) | 2019/1/2 |