TI 並未針對此硬體提供持續直接設計支援。如需在進行設計時獲得支援，請聯絡 Tuya Inc.。
TUYA-3P-WIRELESS-MODULES
概覽
Tuya BDU is a low-power embedded Bluetooth module that Tuya has developed. It consists of a highly integrated Bluetooth chip (CC2340R5), a few peripheral circuits, an embedded Bluetooth network communication protocol stack, and rich library functions.
BDU consists of a low-power 32-bit MCU, a Bluetooth LE 5.3/2.4G radio-frequency band, 512 KB flash memory, and 36 KB SRAM.
特點
- Embedded with a low-power 32-bit MCU, which can also function as an application processor.
- Clock rate: 48 MHz
- Working voltage: 1.71 to 3.8 V
- Peripherals: 5 PWMs, 2 UART pins, and 2 ADC pins
- Bluetooth LE RF features
- Compatible with the Bluetooth LE 5.3
- The RF data rate can be up to 1 Mbps
- TX power: +8 dBm
- RX sensitivity: -96 dBm@Bluetooth LE 1 Mbps
- Embedded hardware AES encryption
- Onboard PCB antenna with a gain of 1 dBi
- Working temperature: -40°C to +105°C
低耗電 2.4GHz 產品
訂購並開始開發
子卡
Tuya-BDU-Module — 低功率嵌入式藍牙模組
Tuya-BDU-Module — 低功率嵌入式藍牙模組
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