Hi. This is Millimeter Wave EVMS Deep Dive. Here's the agenda. We'll first talk about the millimeter wave EVM terminologies. There are two types of EVMs-- BoosterPack and DevPack. For each of the EVM, we'll show the block diagram. For the connectivity ecosystem, we'll show the platforms, connectivity with TI LaunchPad, and the connectivity with TSW 1,400.

Millimeter Wave EVM terminologies. The BoosterPack EVMs-- BoosterPack are EVM boards with millimeter waves SOC onboard. It allows plug-in ability to interface with LaunchPads. We have 12, a 14 BoosterPack and a 16 BoosterPack available. Another type of EVM is development packs, or DevPack. It add on board for particular set of BoosterPack EVMs to support higher capability of debug. It allows connectivity with PC, for organizing radar data during development. DevPack EVM is compatible for both 12, 14, and 16 BoosterPack.

This is 12, 14 BoosterPack block background. Since there is a millimeter sensor as you'll see, it is connected to 4x RX 3 TX antennas. The [? clock ?] system is supported with onboard 40 megahertz crystal. 5 volt input with PMIC and LDOs for power supply. xds 110 [INAUDIBLE] emulation with [? zero port ?] for onboard [? skills by ?] flash programming. Back channel [? UR through ?] USB to PC for logging purposes, while onboard can transceiver.

The connectors are used with all the traces listed for user application and debug. Note that for the tau BoosterPack, it is a closed system. Only spy for configuration and LVDS/CSI2 for data transfer. Also, if [INAUDIBLE] BoosterPack, xds, and the CAN support is not available, [INAUDIBLE] support is not using [INAUDIBLE].

This is 16 BoosterPack block diagram. Compared to the 14 BoosterPack, the major difference is two TX instead of three, CAN-FD instead of CAN receiver. However, for industrial application, CAN-FD is not supported here. [INAUDIBLE] [? HD ?] connector is only LVDS and not CSI. And in addition, EMM interface is added.

This is the DevPack EVM block diagram. The 2-20 pin connector provides connectivity to Launchpad. [? They're stuck in a ?] CAN transceiver. Onboard FTDI chip provides PC interface for SPI, I2C, GPL controls and UR loggers. 60-MIPI connector for JTAG trees. And the 120 Samtec connector with LVDS signal trace.

This is connectivity ecosystem. BoosterPack alone connected to PC can be used for software development with CCS. BoosterPack together with DevPack is connected with TSW 1400 for raw data capture. An ecosystem with TI Launchpad can be used for sensitive development and debug.

Examples of hardware platforms are presented here. BoosterPack alone it enables evaluation of single chip millimeter width sensor. 4Rx/3Tx transceiver with the ranged Doppler angle FFT capability. Proximity sensor demo is included in millimeter wave SDK. BoosterPack, DevPack, and TSW1400 system enables RF performance evaluation. Raw ADC data can be captured and processed to PC. [INAUDIBLE] of range velocity angle are made possible with mmWave Studio. BoosterPack with TI Launchpad enables RF performance evaluation and a wireless connectivity.

This is BoosterPack header pin-out diagram. There are [? 220P ?] headers on the back of BoosterPack EVM [INAUDIBLE] signals [INAUDIBLE]. This is the connectivity of BoosterPack with TI Launchpad. Center is the 40 pin-outs msp 432 p401r Launchpad, showing all the functions for which the device pins can be configured on the two sides of BoosterPack plug in module standard, as we show in previous page. The connectivity with TSW1400 shows a block diagram of the three EVMs, BoosterPack, DevPack, and TSW1400. The BoosterPack and DevPack are connected to the [? 220P ?] header and the six DP high density connectors using Samtec cable. The connection to TSW1400 can be through the [? 120P ?] Samtec cable or direct connection between DevPack and TSW1400.