Home
Video library

Maximizing 36V, 4A power density with enhanced thermal performance

00:02:09 | 12 DEC 2019

Every power supply designer is trying to maximize efficiency and eliminate every last milliwatt that is lost as heat in DC/DC conversion. So what if I told you that TI has a power module that not only allows you to boost DC/DC conversion efficiency, but also do so with a smaller power supply footprint? 

The TPSM53604 is the first device in TI's power module portfolio to offer you this combination in Enhanced HotRod™ QFN package, with a solution size that is 30% smaller than competing BGA solutions while also providing a 300mW reduction in power loss. Watch the video to learn more.

Resources

  • download Download the TPSM53604 datasheet
  • arrow-right Learn more about TPSM53604
  • arrow-right Improve power module thermal performance with TPSM53604 in Enhanced HotRod™ QFN packaging
download

Browse videos

View all videos
View all videos
Products
  • Amplifiers
  • Audio, haptics & piezo
  • Clocks & timing
  • DLP products
  • Data converters
  • Die & wafer services
  • Interface
  • Isolation
  • Logic & voltage translation
  • Microcontrollers (MCUs) & processors
  • Motor drivers
  • Power management
  • RF & microwave
  • Sensors
  • Switches & multiplexers
  • Wireless connectivity
Applications
  • Automotive
  • Communications equipment
  • Data center
  • Industrial
  • Personal electronics