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TPSM53604

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36-V, 4-A step-down power module in small 5.5 x 5 x 4mm RLF QFN package with simple footprint

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Product details

Parameters

Iout (Max) (A) 4 Vin (Min) (V) 3.8 Vin (Max) (V) 36 Vout (Min) (V) 1 Vout (Max) (V) 7 Soft start Fixed Features EMI Tested, Enable, Light Load Efficiency, Power Good Operating temperature range (C) -40 to 125 Iq (Typ) (mA) 0.024 Regulated outputs (#) 1 Switching frequency (Typ) (kHz) 1400 Duty cycle (Max) (%) 98 Type Module Topology Buck, Inverting Buck-Boost, Synchronous Buck open-in-new Find other Buck modules (integrated inductor)

Package | Pins | Size

B3QFN (RDA) 15 28 mm² 5 x 5 open-in-new Find other Buck modules (integrated inductor)

Features

  • 5 mm × 5.5 mm × 4 mm routable lead-frame (RLF) QFN package
    • Industry’s smallest 36-V, 4-A footprint:
      85 mm2 solution size (single sided)
    • Low EMI: Meets CISPR11 radiated emissions
    • Excellent thermal performance:
      Up to 20 W output power at 85ºC, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • 3.8 V to 36 V input voltage range
  • Output voltage range: 1 V to 7 V
  • Efficiency up to 95%
  • Power-good flag
  • Precision enable
  • Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
  • Operating IC junction range: –40°C to +125°C
  • Operating ambient range: –40°C to +105°C
  • Shock and vibration tested to Mil-STD-883D
  • Pin compatible with: 3-A TPSM53603
    and 2-A TPSM53602
  • Create a custom design using the TPSM53604 with the WEBENCH® Power Designer

All trademarks are the property of their respective owners.

open-in-new Find other Buck modules (integrated inductor)

Description

The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5 mm x 5.5 mm x 4 mm, 15-pin QFN package uses routable lead-frame technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.

open-in-new Find other Buck modules (integrated inductor)
Download

Technical documentation

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Type Title Date
* Datasheet TPSM53604 36-V Input, 4-A Power Module in RLF QFN Package datasheet (Rev. A) Dec. 09, 2019
Application notes Soldering Requirements for BQFN Packages (Rev. C) Mar. 05, 2020
Technical articles 35 years later, APEC continues to set the tone for innovation in power management Feb. 27, 2020
User guides Using the TPSM53604EVM, TPSM53603EVM, and TPSM53602EVM (Rev. B) Dec. 13, 2019
Application notes Practical Thermal Design With DC/DC Power Modules (Rev. A) Nov. 20, 2019
Application notes Using the TPSM5360x for an Inverting Buck-Boost Application Oct. 29, 2019
Application notes Soldering Considerations for Power Modules Nov. 26, 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
$49.00
Description
The TPSM53604 evaluation board (EVM) is configured to evaluate the operation of the TPSM53604 power module for current up to 4 A. The input voltage range is 3.8 V to 36 V. The output voltage range is 1 V to 7 V. The evaluation board makes it easy to evaluate the TPSM53604 operation.
Features
  • 3.8-V to 36-V input voltage range
  • Up to 4 A of output current
  • 1-V to 7-V output voltage
  • 5-mm x 5.5-mm QFN package

CAD/CAE symbols

Package Pins Download
B3QFN (RDA) 15 View options

Ordering & quality

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Videos

Unlock improved power module thermal performance with TPSM53604 and RLF QFN packaging

Improve power module thermal performance with a smaller footprint using TPSM53604 and RLF QFN packaging

Posted: 12-Jan-2019
Duration: 02:29

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