Home Power management DC/DC power modules Power modules (integrated inductor)
Home
Power management
DC/DC power modules
Power modules (integrated inductor)

TPSM53604

ACTIVE

36-V, 4-A step-down power module in small 5.5 x 5 x 4-mm Enhanced HotRod™ QFN with simple footprint

Order now
Data sheet

A newer version of this product is available

open-in-new Compare alternates
Same functionality with different pin-out to the compared device
TPSM63604 ACTIVE 36-V input, 16-V output, 4-A synchronous step-down DC-DC power module Wider output voltage range, improved optimization for performance and ultra-low EMI

TPSM53604

ACTIVE
Data sheet Order now

Product details

Rating Catalog Topology Buck, Inverting Buck-Boost, Synchronous Buck Iout (max) (A) 4 Vin (max) (V) 36 Vin (min) (V) 3.8 Vout (max) (V) 7 Vout (min) (V) 1 Features EMI Tested, Enable, Light-load efficiency, Power good EMI features Low parasitic Hotrod packaging Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Type Module Duty cycle (max) (%) 98 Control mode current mode Switching frequency (min) (kHz) 1400 Switching frequency (max) (kHz) 1400
Rating Catalog Topology Buck, Inverting Buck-Boost, Synchronous Buck Iout (max) (A) 4 Vin (max) (V) 36 Vin (min) (V) 3.8 Vout (max) (V) 7 Vout (min) (V) 1 Features EMI Tested, Enable, Light-load efficiency, Power good EMI features Low parasitic Hotrod packaging Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Type Module Duty cycle (max) (%) 98 Control mode current mode Switching frequency (min) (kHz) 1400 Switching frequency (max) (kHz) 1400
B3QFN (RDA) 15 27.5 mm² 5.5 x 5
  • Functional Safety-Capable
  • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package
    • Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided)
    • Low EMI: meets CISPR11 radiated emissions
    • Excellent thermal performance: up to 20 W output power at 85°C, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • Input voltage range: 3.8 V to 36 V
  • Output voltage range: 1 V to 7 V
  • Efficiency up to 95%
  • Power-good flag
  • Precision enable
  • Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
  • Operating IC junction range: –40°C to +125°C
  • Operating ambient range: –40°C to +105°C
  • Shock and vibration tested to Mil-STD-883D
  • Pin compatible with: 3-A TPSM53603 and 2-A TPSM53602
  • Create a custom design using the TPSM53604 with the WEBENCH Power Designer
  • Download the EVM Design Files for fast board design
  • Functional Safety-Capable
  • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package
    • Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided)
    • Low EMI: meets CISPR11 radiated emissions
    • Excellent thermal performance: up to 20 W output power at 85°C, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • Input voltage range: 3.8 V to 36 V
  • Output voltage range: 1 V to 7 V
  • Efficiency up to 95%
  • Power-good flag
  • Precision enable
  • Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
  • Operating IC junction range: –40°C to +125°C
  • Operating ambient range: –40°C to +105°C
  • Shock and vibration tested to Mil-STD-883D
  • Pin compatible with: 3-A TPSM53603 and 2-A TPSM53602
  • Create a custom design using the TPSM53604 with the WEBENCH Power Designer
  • Download the EVM Design Files for fast board design

The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.

The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.
filter Find other Power modules (integrated inductor)
Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Same functionality with different pin-out to the compared device
TPSM63603 ACTIVE High-density, 3-V to 36-V input, 1-V to 16-V output, 3-A power module Lower output current and improved performance.
TPSM63606 ACTIVE High-density, 36-V input, 1-V to 16-V output, 6-A power module in 5-mm x 5.5-mm enhanced HotRod™ QFN Greater output current and improved performance.

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 10
Top documentation Type Title Format options Date
* Data sheet TPSM53604 36-V Input, 4-A Power Module in Enhanced HotRod™ QFN Package datasheet (Rev. C) PDF | HTML 30 Sep 2021
Application note Soldering Considerations for Power Modules (Rev. C) PDF | HTML 14 Mar 2024
White paper Addressing Factory Automation Challenges with Innovations in Power Design 28 Sep 2021
Functional safety information TPSM53604 Functional Safety, FIT Rate, Failure Mode Distribution, and Pin FMA PDF | HTML 24 Aug 2021
Technical article Powering medical imaging applications with DC/DC buck converters PDF | HTML 24 Nov 2020
Application note Soldering Requirements for BQFN Packages (Rev. C) 05 Mar 2020
Technical article 35 years later, APEC continues to set the tone for innovation in power management PDF | HTML 27 Feb 2020
Application note Practical Thermal Design With DC/DC Power Modules (Rev. A) 20 Nov 2019
White paper Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Packaging 19 Nov 2019
Application note Using the TPSM5360x for an Inverting Buck-Boost Application 29 Oct 2019

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TPSM53604EVM — 3.8-V to 36-V input, 4-A power module evaluation board

The TPSM53604 evaluation board (EVM) is configured to evaluate the operation of the TPSM53604 power module for current up to 4 A. The input voltage range is 3.8 V to 36 V. The output voltage range is 1 V to 7 V. The evaluation board makes it easy to evaluate the TPSM53604 operation.
User guide: PDF
Not available on TI.com
Simulation model

TPSM53604 PSpice Transient Model

SNVMC56.ZIP (387 KB) - PSpice Model
Download
Design tool

SNVR482 — TPSM53604 EVM Design Files

Supported products & hardware

Supported products & hardware
Download
Package Pins CAD symbols, footprints & 3D models
B3QFN (RDA) 15 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos