TI's power modules utilize MagPack™ packaging technology for improved EMI performance

TI's power modules with MagPack™ packaging technology feature proprietary magnetic mold compound technology and are a feature of our switching regulators with mitigated, interference and noise technology (MINT). When comparing modules using traditional exposed inductor or side-by-side constructing, devices with MagPack technology perform better in EMI testing due to the inherent shielding that comes from the packaging technology.