SNAS378L November   2008  – February 2019 ADC14155QML-SP

PRODUCTION DATA.  

  1. Features
  2. Applications
    1.     Block Diagram
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Descriptions and Equivalent Circuits
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  ADC14155 Converter Electrical Characteristics DC Parameters
    6. 6.6  ADC14155 Converter Electrical Characteristics (Continued) DYNAMIC Parameters
    7. 6.7  ADC14155 Converter Electrical Characteristics (Continued) Logic and Power Supply Electrical Characteristics
    8. 6.8  ADC14155 Converter Electrical Characteristics (Continued) Timing and AC Characteristics
    9. 6.9  Timing Diagram
    10. 6.10 Transfer Characteristic
    11. 6.11 Typical Performance Characteristics, DNL, INL
    12. 6.12 Typical Performance Characteristics, Dynamic Performance
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
        1. 7.3.1.1 Differential Analog Input Pins
        2. 7.3.1.2 Driving The Analog Inputs
        3. 7.3.1.3 Input Common Mode Voltage
      2. 7.3.2 Reference Pins
      3. 7.3.3 Digital Inputs
        1. 7.3.3.1 Clock Inputs
        2. 7.3.3.2 Power-Down (PD)
        3. 7.3.3.3 Clock Mode Select/Data Format (CLK_SEL/DF)
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Radiation Environments
      1. 8.3.1 Total Ionizing Dose (TID)
      2. 8.3.2 Single Event Effects
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NBA|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

For best dynamic performance, the center die attach pad of the device should be connected to ground with low inductive path.

Proper grounding and proper routing of all signals are essential to ensure accurate conversion. Maintaining separate analog and digital areas of the board, with the ADC14155 between these areas, is required to achieve specified performance.

The ground return for the data outputs (DRGND) carries the ground current for the output drivers. The output current can exhibit high transients that could add noise to the conversion process. To prevent this from happening, it is recommended to use a single common ground plane with managed return current paths instead of a split ground plane. The key is to make sure that the supply current in the ground plane does not return under a sensitive node (e.g., caps to ground in the analog input network). This is done by routing a trace from the ADC to the regulator / bulk capacitor for the supply so that it does not run under a critical node.

Capacitive coupling between the typically noisy digital circuitry and the sensitive analog circuitry can lead to poor performance. The solution is to keep the analog circuitry separated from the digital circuitry, and to keep the clock line as short as possible.

The effects of the noise generated from the ADC output switching can be minimized through the use of 22-Ω resistors in series with each data output line. Locate these resistors as close to the ADC output pins as possible.

Since digital switching transients are composed largely of high frequency components, total ground plane copper weight will have little effect upon the logic-generated noise. This is because of the skin effect. Total surface area is more important than is total ground plane area.

Generally, analog and digital lines should cross each other at 90° to avoid crosstalk. To maximize accuracy in high speed, high resolution systems, however, avoid crossing analog and digital lines altogether. It is important to keep clock lines as short as possible and isolated from ALL other lines, including other digital lines. Even the generally accepted 90° crossing should be avoided with the clock line as even a little coupling can cause problems at high frequencies. This is because other lines can introduce jitter into the clock line, which can lead to degradation of SNR. Also, the high speed clock can introduce noise into the analog chain.

Best performance at high frequencies and at high resolution is obtained with a straight signal path. That is, the signal path through all components should form a straight line wherever possible.

Be especially careful with the layout of inductors and transformers. Mutual inductance can change the characteristics of the circuit in which they are used. Inductors and transformers should not be placed side by side, even with just a small part of their bodies beside each other. For instance, place transformers for the analog input and the clock input at 90° to one another to avoid magnetic coupling.

The analog input should be isolated from noisy signal traces to avoid coupling of spurious signals into the input. Any external component (e.g., a filter capacitor) connected between the converter's input pins and ground or to the reference input pin and ground should be connected to a very clean point in the ground plane.

All analog circuitry (input amplifiers, filters, reference components, etc.) should be placed in the analog area of the board. All digital circuitry and dynamic I/O lines should be placed in the digital area of the board. The ADC14155 should be between these two areas. Furthermore, all components in the reference circuitry and the input signal chain that are connected to ground should be connected together with short traces and enter the ground plane at a single, quiet point. All ground connections should have a low inductance path to ground.