SPRSP98 November   2023 AM625SIP

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes and Signal Descriptions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Operating Performance Points
    5. 6.5 Thermal Resistance Characteristics
      1. 6.5.1 Thermal Resistance Characteristics for AMK Package
    6. 6.6 Timing and Switching Characteristics
      1. 6.6.1 Power Supply Requirements
        1. 6.6.1.1 Power Supply Sequencing
  8. 7 Applications, Implementation, and Layout
    1. 7.1 Peripheral- and Interface-Specific Design Information
      1. 7.1.1 Integrated LPDDR4 SDRAM Information
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
      1. 8.1.1 Standard Package Symbolization
      2. 8.1.2 Device Naming Convention
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AMK|425
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5 Trademarks

Code Composer Studio™ and TI E2E™ are trademarks of Texas Instruments.

Arm®, Cortex®, and TrustZone® are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

MIPI® is a registered trademark of MIPI Alliance.

Secure Digital® and SD® are registered trademarks of SD Card Association.

ISSI® is a registered trademark of Integrated Silicon Solution, Inc.

All trademarks are the property of their respective owners.