SPRSP98 November   2023 AM625SIP

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes and Signal Descriptions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Operating Performance Points
    5. 6.5 Thermal Resistance Characteristics
      1. 6.5.1 Thermal Resistance Characteristics for AMK Package
    6. 6.6 Timing and Switching Characteristics
      1. 6.6.1 Power Supply Requirements
        1. 6.6.1.1 Power Supply Sequencing
  8. 7 Applications, Implementation, and Layout
    1. 7.1 Peripheral- and Interface-Specific Design Information
      1. 7.1.1 Integrated LPDDR4 SDRAM Information
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
      1. 8.1.1 Standard Package Symbolization
      2. 8.1.2 Device Naming Convention
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AMK|425
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Applications, Implementation, and Layout

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.