SBOS030C August   2000  – March 2024 BUF634

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: TO-220 and TO-263 Packages
    6. 6.6 Electrical Characteristics: Wide-Bandwidth Mode for SOIC Package
    7. 6.7 Electrical Characteristics: Low-Quiescent-Current Mode for SOIC Package
    8. 6.8 Typical Characteristics: TO-220 and TO-263 Packages
    9. 6.9 Typical Characteristics: SOIC Package
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Current
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 High Frequency Applications
    2. 8.2 Typical Application
      1. 8.2.1 Boosting Op Amp Output Current
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 TINA-TI™ Simulation Software (Free Download)
        2. 9.1.1.2 TI Reference Designs
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • KTT|5
  • KC|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics: SOIC Package

at TA = 25°C, VS = ±15 V, RS = 50 Ω, and RL = 100 Ω (unless otherwise noted).

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Figure 6-19 Gain and Phase vs Frequency and Quiescent Current
GUID-7D4AE0EB-7583-457F-B5B6-0A0AE22D7146-low.gif
Solid lines indicate wide-BW mode,
dashed lines indicate low-IQ mode
Figure 6-21 Gain and Phase vs Frequency and Source Resistance
GUID-FEAF6DA3-5EFC-4020-AC30-FF89216ADEE1-low.gif
Low-IQ mode
Figure 6-23 Gain and Phase vs Frequency and Load Capacitance
GUID-BFB48145-6C93-46C4-999E-192DCD62F08D-low.gif
Solid lines indicate wide-BW mode,
dashed lines indicate low-IQ mode
Figure 6-25 Gain and Phase vs Frequency and Power-Supply Voltage
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Figure 6-27 Voltage Noise Density vs Frequency
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Wide-BW mode, VIN = 10 VPP, RL = 1 kΩ
Figure 6-29 Harmonic Distortion vs Frequency
GUID-77A996FC-114C-43D7-848C-36D4E10BF161-low.gif
Low-IQ mode, VIN = 10 VPP, RL = 1 kΩ
Figure 6-31 Harmonic Distortion vs Frequency
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Figure 6-33 Small-Signal Bandwidth vs Bandwidth Adjustment Resistance
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Wide-BW mode (solid lines indicate sourcing current,
dashed lines indicate sinking current)
Figure 6-35 Output Voltage Swing vs Output Current
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Figure 6-37 Large-Signal Transient Response
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f = 100 kHz
Figure 6-39 Output Impedance vs Output Current
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Figure 6-41 Offset Voltage vs Supply Voltage
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35 devices
 
Figure 6-43 Offset Voltage vs Temperature
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Low-IQ mode, 35 devices
Figure 6-45 Input Bias Current vs Supply Voltage
GUID-F2778065-8D09-4B12-AE4D-4A1D769B99FF-low.gif
Low-IQ mode, 35 devices
Figure 6-47 Quiescent Current vs Supply Voltage
GUID-E6DD2738-CE2A-494F-9941-DECBA2339556-low.gif
Low-IQ mode, 35 devices
Figure 6-49 Quiescent Current vs Temperature
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Low-IQ mode, 35 devices
Figure 6-51 Buffer Gain vs Temperature
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Figure 6-53 Maximum Power Dissipation vs Temperature
GUID-A00959CF-059E-42E5-B9D0-CAA5BAB3DD0D-low.gif
Solid lines indicate wide-BW mode,
dashed lines indicate low-IQ mode
Figure 6-20 Gain and Phase vs Frequency and Temperature
GUID-F7AC546D-937F-4510-AA12-10BA0DB0C143-low.gif
Solid lines indicate wide-BW mode,
dashed lines indicate low-IQ mode
Figure 6-22 Gain and Phase vs Frequency and Load Resistance
GUID-6F3299D2-7D22-4C26-A256-F689B7FB430D-low.gif
Wide-BW mode
Figure 6-24 Gain and Phase vs Frequency and Load Capacitance
GUID-BEC190D2-2795-4F33-A76D-D9BCD0476588-low.gif
Solid lines indicate wide-BW mode,
dashed lines indicate low-IQ mode
Figure 6-26 PSRR vs Frequency
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Figure 6-28 Current Noise Density vs Frequency
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Wide-BW mode, VIN = 10 VPP, RL = 100 Ω
Figure 6-30 Harmonic Distortion vs Frequency
GUID-AF877544-C3C6-4F3B-8160-D77D0A97730B-low.gif
Low-IQ mode, VIN = 10 VPP, RL = 100 Ω
Figure 6-32 Harmonic Distortion vs Frequency
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Figure 6-34 Short-Circuit Current vs Temperature
GUID-02AE203F-3B3D-40E5-9C01-9B22B491E14B-low.gif
Low-IQ mode (solid lines indicate sourcing current,
dashed lines indicate sinking current)
Figure 6-36 Output Voltage Swing vs Output Current
GUID-78AAF5F6-62E9-4230-9581-EABD63584DF1-low.gif
 
Figure 6-38 Small-Signal Transient Response
GUID-13FE7348-C4E4-46E8-8A27-3BBF09BE9507-low.gif
IO = 100 mA
Figure 6-40 Output Impedance vs Frequency
GUID-7D0F6F26-62CF-4338-91D9-8C41187006E2-low.gif
14000 devices, µ = 35.7 mV, σ = 2.15 mV
Figure 6-42 Offset Voltage Distribution Histogram
GUID-B1765DC8-87B0-483E-8252-FF10253E8563-low.gif
TA = –40°C to +125°C, 35 devices,
µ = 134 μV/°C, σ = 7.4 μV/°C
Figure 6-44 Offset Voltage Drift Distribution Histogram
GUID-13E7828E-CCA7-4725-B99F-2D2F3F238993-low.gif
Wide-BW mode, 35 devices
Figure 6-46 Input Bias Current vs Supply Voltage
GUID-38E78536-1059-46A4-AC28-BB89AC3DE8D9-low.gif
Wide-BW mode, 35 devices
Figure 6-48 Quiescent Current vs Supply Voltage
GUID-6831904E-BC5E-4ACE-99BF-EB76BBCA9619-low.gif
Wide-BW mode, 35 devices
Figure 6-50 Quiescent Current vs Temperature
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Wide-BW mode, 35 devices
Figure 6-52 Buffer Gain vs Temperature