SBOS948F February   2019  – May 2021 BUF634A

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Wide-Bandwidth Mode
    6. 7.6 Electrical Characteristics: Low-Quiescent Current Mode
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Current
      2. 8.3.2 Thermal Shutdown
      3. 8.3.3 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Adjustable Bandwidth
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 High-Frequency Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Dissipation and Thermal Considerations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 SOIC Layout Guidelines (D Package Without a Thermal Pad)
      2. 11.1.2 HSOIC Layout Guidelines (DDA Package With a Thermal Pad)
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 TINA-TI (Free Software Download)
        2. 12.1.2.2 TI Precision Designs
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDA|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

At TA = 25°C, VS = ±15 V, RS = 50 Ω, and RL = 100 Ω (unless otherwise noted).

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Figure 7-1 Gain and Phase vs Frequency and Quiescent Current
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Solid lines indicate wide-BW mode, dashed lines indicate low-IQ mode
Figure 7-3 Gain and Phase vs Frequency and Source Resistance
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Low-IQ mode
Figure 7-5 Gain and Phase vs Frequency and Load Capacitance
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Solid lines indicate wide-BW mode, dashed lines indicate low-IQ mode
Figure 7-7 Gain and Phase vs Frequency and Power-Supply Voltage
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Figure 7-9 Voltage Noise Density vs Frequency
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Wide-BW mode, VIN = 10 VPP, RL = 1 kΩ
Figure 7-11 Harmonic Distortion vs Frequency
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Low-IQ mode, VIN = 10 VPP, RL = 1 kΩ
Figure 7-13 Harmonic Distortion vs Frequency
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Figure 7-15 Small-Signal Bandwidth vs Bandwidth Adjustment Resistance
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Wide-BW mode (solid lines indicate sourcing current, dashed lines indicate sinking current)
Figure 7-17 Output Voltage Swing vs Output Current
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Figure 7-19 Large-Signal Transient Response
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f = 100 kHz
Figure 7-21 Output Impedance vs Output Current
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Figure 7-23 Offset Voltage vs Supply Voltage
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35 devices
Figure 7-25 Offset Voltage vs Temperature
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Low-IQ mode, 35 devices
Figure 7-27 Input Bias Current vs Supply Voltage
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Low-IQ mode, 35 devices
Figure 7-29 Quiescent Current vs Supply Voltage
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Low-IQ mode, 35 devices
Figure 7-31 Quiescent Current vs Temperature
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Low-IQ mode, 35 devices
Figure 7-33 Buffer Gain vs Temperature
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Figure 7-35 Maximum Power Dissipation vs Temperature
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Solid lines indicate wide-BW mode, dashed lines indicate low-IQ mode
Figure 7-2 Gain and Phase vs Frequency and Temperature
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Solid lines indicate wide-BW mode, dashed lines indicate low-IQ mode
Figure 7-4 Gain and Phase vs Frequency and Load Resistance
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Wide-BW mode
Figure 7-6 Gain and Phase vs Frequency and Load Capacitance
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Solid lines indicate wide-BW mode, dashed lines indicate low-IQ mode
Figure 7-8 PSRR vs Frequency
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Figure 7-10 Current Noise Density vs Frequency
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Wide-BW mode, VIN = 10 VPP, RL = 100 Ω
Figure 7-12 Harmonic Distortion vs Frequency
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Low-IQ mode, VIN = 10 VPP, RL = 100 Ω
Figure 7-14 Harmonic Distortion vs Frequency
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Figure 7-16 Short-Circuit Current vs Temperature
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Low-IQ mode (solid lines indicate sourcing current, dashed lines indicate sinking current)
Figure 7-18 Output Voltage Swing vs Output Current
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Figure 7-20 Small-Signal Transient Response
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IO = 100 mA
Figure 7-22 Output Impedance vs Frequency
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14000 devices, µ = 35.7 mV, σ = 2.15 mV
Figure 7-24 Offset Voltage Distribution Histogram
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TA = –40°C to +125°C, 35 devices, µ = 134 μV/°C, σ = 7.4 μV/°C
Figure 7-26 Offset Voltage Drift Distribution Histogram
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Wide-BW mode, 35 devices
Figure 7-28 Input Bias Current vs Supply Voltage
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Wide-BW mode, 35 devices
Figure 7-30 Quiescent Current vs Supply Voltage
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Wide-BW mode, 35 devices
Figure 7-32 Quiescent Current vs Temperature
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Wide-BW mode, 35 devices
Figure 7-34 Buffer Gain vs Temperature