SWRS194J January   2018  – November 2023 CC2642R

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1 Reset Timing
      2. 8.12.2 Wakeup Timing
      3. 8.12.3 Clock Specifications
        1. 8.12.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.12.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.12.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 8.12.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 8.12.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.12.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.12.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       35
      5. 8.12.5 UART
        1. 8.12.5.1 UART Characteristics
    13. 8.13 Peripheral Characteristics
      1. 8.13.1 ADC
        1. 8.13.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.13.2 DAC
        1. 8.13.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.13.3 Temperature and Battery Monitor
        1. 8.13.3.1 Temperature Sensor
        2. 8.13.3.2 Battery Monitor
      4. 8.13.4 Comparators
        1. 8.13.4.1 Low-Power Clocked Comparator
        2. 8.13.4.2 Continuous Time Comparator
      5. 8.13.5 Current Source
        1. 8.13.5.1 Programmable Current Source
      6. 8.13.6 GPIO
        1. 8.13.6.1 GPIO DC Characteristics
    14. 8.14 Typical Characteristics
      1. 8.14.1 MCU Current
      2. 8.14.2 RX Current
      3. 8.14.3 TX Current
      4. 8.14.4 RX Performance
      5. 8.14.5 TX Performance
      6. 8.14.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  12. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Microcontroller
    • Powerful 48 MHz Arm® Cortex®-M4F processor
    • EEMBC CoreMark® score: 148
    • 352 kB of in-system programmable flash
    • 256 kB of ROM for protocols and library functions
    • 8 kB of cache SRAM (alternatively available as general-purpose RAM)
    • 80 kB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4 kB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth® 5.2 low energy controller in ROM for optimized application size
  • RoHS-compliant package
    • 7 mm × 7 mm RGZ VQFN48 (31 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • 4× 32-bit or 8× 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC
      (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C and I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit cryptographic accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • On-chip buck DC/DC converter
  • Low power
    • Active mode RX: 6.9 mA
    • Active mode TX 0 dBm: 7.0 mA
    • Active mode TX 5 dBm: 9.2 mA
    • Active mode MCU 48 MHz (CoreMark):
      3.4 mA (71 μA/MHz)
    • Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.1 μA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808 μA
    • Standby: 0.94 µA (RTC on, 80 kB RAM and CPU retention)
    • Shutdown: 150 nA (wakeup on external events)
  • Radio section
    • 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications
    • 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
    • Excellent receiver sensitivity:
      -105 dBm for Bluetooth 125 kbps (LE Coded PHY)
      -97 dBm for 1 Mbps PHY
    • Output power up to +5 dBm with temperature compensation
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • EN 300 328, (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T66 (Japan)
  • Development Tools and Software