SLPS449F October   2013  – January 2022 CSD25483F4

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Trademarks
    2. 6.2 Electrostatic Discharge Caution
    3. 6.3 Glossary
  7. 7Mechanical Data
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 CSD25483F4 Embossed Carrier Tape Dimensions

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YJC|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision E (October 2021) to Revision F (January 2022)

  • Changed Maximum height from "0.35 mm" to "0.36 mm" in Features Go
  • Changed height dimension from "0.35 mm" to "0.36 mm" in Typical Device Dimensions Go
  • Changed maximum height dimension from "0.35 mm" to "0.36 mm" in Mechanical Dimensions Go

Changes from Revision D (October 2014) to Revision E (October 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added footnote with link to support documentGo

Changes from Revision C (July 2014) to Revision D (October 2014)

  • Corrected timing VDS to read –10 V Go

Changes from Revision B (February 2014) to Revision C (July 2014)

Changes from Revision A (December 2013) to Revision B (February 2014)

  • Updated lead and halogen free in features Go
  • Added IG parameterGo
  • Lowered IDSS limitGo
  • Lowered IGSS limitGo

Changes from Revision * (October 2013) to Revision A (December 2013)

  • Fixed resistance typoGo
  • Added small reelGo