DLPS076B November   2017  – June 2019 DLP3030-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      DLP DLP3030-Q1 Block System Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Optical Characteristics of the Micromirror Array
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Micromirror Array
      2. 7.3.2 Double Data Rate (DDR) Interface
      3. 7.3.3 Micromirror Switching Control
      4. 7.3.4 DMD Voltage Supplies
      5. 7.3.5 Logic Reset
      6. 7.3.6 Temperature Sensing Diode
        1. 7.3.6.1 Temperature Sense Diode Theory
      7. 7.3.7 Active Array Temperature
      8. 7.3.8 DMD JTAG Interface
    4. 7.4 Optical Performance
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill and Alignment
    5. 7.5 DMD Image Quality Specification
    6. 7.6 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 HUD Reference Design and LED Controller Reference Design
    3. 8.3 Application Mission Profile Consideration
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Sequencing Requirements
      1. 9.1.1 Power Up and Power Down
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Temperature Diode Pins
    3. 10.3 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Device Handling
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.7 Active Array Temperature

NOTE

Calculation is not valid for a headlight application utilizing an optically underfilled active array. Contact TI Applications Engineering for array temperature calculation methods for headlight applications.

Active array temperature can be computed analytically from measurement points on the outside of the package, the package thermal resistance, the electrical power, and the illumination heat load.

Relationship between array temperature and the reference ceramic temperature (thermocouple location TP1 in Figure 12) is provided by the following equations.

Equation 1. TARRAY = TCERAMIC + (QARRAY × RARRAY-TO-CERAMIC)
Equation 2. QARRAY = QELECTRICAL+ QILLUMINATION

where

  • TARRAY = computed DMD array temperature (°C)
  • TCERAMIC = measured ceramic temperature (TP1 location in Figure 12) (°C)
  • RARRAY-TO-CERAMIC = DMD package thermal resistance from array to TP1 (°C/watt) (see Thermal Information)
  • QARRAY = total power, electrical plus absorbed, on the DMD array (watts)
  • QELECTRICAL = nominal electrical power dissipation by the DMD (watts)
  • QILLUMINATION = (CL2W × SL)
  • CL2W = conversion constant for screen lumens to power on the DMD (watts/lumen)
  • SL = measured screen lumens (lm)

Electrical power dissipation of the DMD is variable and depends on the voltages, data rates and operating frequencies.

Absorbed power from the illumination source is variable and depends on the operating state of the mirrors and the intensity of the light source.

Equations shown previous are valid for a 1-Chip DMD system with total projection efficiency from DMD to the screen of 87%.

The constant CL2W is based on the DMD array characteristics. It assumes a spectral efficiency of 300 lumens/watt for the projected light and illumination distribution of 83.7% on the active array, and 16.3% on the array border.

Sample calculation:

  • SL = 50 lm
  • CL2W = 0.00293
  • QELECTRICAL = 0.105 W
  • RARRAY-TO-CERAMIC = 2.5°C/W
  • TCERAMIC = 55°C
    • Equation 3. QARRAY = 0.105 W + (0.00293 × 50 lm) = 0.252 W
    Equation 4. TARRAY = 55°C + (0.252 W × 2.5°C/W) = 55.6°C

DLP3030-Q1 thermocouple_locations.gifFigure 12. Thermocouple Locations