SNLS456D March   2016  – October 2019 DS250DF410

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements, Retimer Jitter Specifications
    7. 7.7  Timing Requirements, Retimer Specifications
    8. 7.8  Timing Requirements, Recommended Calibration Clock Specifications
    9. 7.9  Recommended SMBus Switching Characteristics (Slave Mode)
    10. 7.10 Recommended SMBus Switching Characteristics (Master Mode)
    11. 7.11 Recommended JTAG Switching Characteristics
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Device Data Path Operation
      2. 8.3.2  Signal Detect
      3. 8.3.3  Continuous Time Linear Equalizer (CTLE)
      4. 8.3.4  Variable Gain Amplifier (VGA)
      5. 8.3.5  Cross-Point Switch
      6. 8.3.6  Decision Feedback Equalizer (DFE)
      7. 8.3.7  Clock and Data Recovery (CDR)
      8. 8.3.8  Calibration Clock
      9. 8.3.9  Differential Driver with FIR Filter
        1. 8.3.9.1 Setting the Output VOD, Pre-Cursor, and Post-Cursor Equalization
        2. 8.3.9.2 Output Driver Polarity Inversion
      10. 8.3.10 Debug Features
        1. 8.3.10.1 Pattern Generator
        2. 8.3.10.2 Pattern Checker
        3. 8.3.10.3 Eye Opening Monitor
      11. 8.3.11 Interrupt Signals
      12. 8.3.12 JTAG Boundary Scan
    4. 8.4 Device Functional Modes
      1. 8.4.1 Supported Data Rates
      2. 8.4.2 SMBus Master Mode
      3. 8.4.3 Device SMBus Address
    5. 8.5 Programming
      1. 8.5.1 Bit Fields in the Register Set
      2. 8.5.2 Writing to and Reading from the Global/Shared/Channel Registers
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Front-Port Jitter Cleaning Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Active Cable Applications
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Backplane and Mid-plane Applications
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.6 Timing Requirements, Retimer Jitter Specifications

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
JTJ Output total jitter (TJ) Measured at 25.78125 Gbps to a probability level of 1E-12 with PRBS11 data pattern an evaluation board traces de-embedded. 0.17 UIpp @ 1E-12
JRJ Output random Jitter (RJ) Measured at 25.78125 Gbps to a probability level of 1E-12 with PRBS11 data pattern an evaluation board traces de-embedded 6 mUI RMS
JDCD Output duty cycle distortion (DCD) Measured at 25.78125 Gbps to a probability level of 1E-12 with PRBS11 data pattern an evaluation board traces de-embedded 4 mUIpp
JPEAK Jitter peaking Measured at 10.3125 Gbps with PRBS7 data pattern. Peaking frequency in the range of 1 to 6 MHz. 0.8 dB
JPEAK Jitter peaking Measured at 25.78125 Gbps with PRBS7 data pattern. Peaking frequency in the range of 1 to 17 MHz. 0.4 dB
BWPLL PLL bandwidth Data rate of 10.3125Gbps with PRBS7 pattern 5.3 MHz
BWPLL PLL bandwidth Data rate of 25.78125Gbps with PRBS7 pattern 5.5 MHz
JTOL Input jitter tolerance Measured at 25.78125 Gbps with SJ frequency = 190 KHz, 30dB input channel loss, PRBS31 data pattern, 800 mVppd launch amplitude, and 0.078 UIpp total uncorrelated output jitter in addition to the applied SJ. BER < 1E-12. 9 UIpp
JTOL Input jitter tolerance Measured at 25.78125 Gbps with SJ frequency = 940 KHz, 30dB input channel loss, PRBS31 data pattern, 800 mVppd launch amplitude, and 0.078 UIpp total uncorrelated output jitter in addition to the applied SJ. BER < 1E-12. 1 UIpp
JTOL Input jitter tolerance Measured at 25.78125 Gbps with SJ frequency > 15MHz, 30dB input channel loss, PRBS31 data pattern, 800 mVppd launch amplitude, and 0.078 UIpp total uncorrelated output jitter in addition to the applied SJ. BER < 1E-12. 0.3 UIpp
TEMPLOCK- CDR stay-in-lock ambient temperature range, negative ramp. Maximum temperature change below initial CDR lock acquisition temperature. 85 °C starting ambient temperature, ramp rate -3 °C/minute, 1.7 liters/sec airflow, 12 layer PCB. 115 °C
TEMPLOCK+ CDR stay-in-lock ambient temperature range, positive ramp. Maximum temperature change above initial CDR lock acquisition temperature. -40 °C starting ambient temperature, ramp rate +3 °C/minute, 1.7 liters/sec airflow, 12 layer PCB. 125 °C