SLASE82B June   2015  – March 2024 HD3SS3411-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable and Power Savings
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 AC Coupling Capacitors
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Critical Routes
        2. 7.4.1.2 General Routing/Placement Rules
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNITS
ICCDevice active CurrentVCC = 3.3V, OEn = 00.60.8mA
ISTDNDevice shutdown CurrentVCC = 3.3V, OEn = 00.30.6µA
CONOutputs ON Capacitance0.6pF
RONOutput ON resistanceVCC = 3.3V; VCM = 0V to 2V;
IO = –8mA		58Ω
ΔRONOn resistance match between pairs of the same channelVCC = 3.3V ; –0.35V ≤ VIN ≤ 2.35V;
IO = –8mA		0.5Ω
R(FLAT_ON)On resistance flatness
(RON(MAX) – RON(MAIN)		VDD = 3.3V; –0.35V ≤ VIN ≤ 2.35V1Ω
IIH(CTRL)Input high current, control pins
(SEL, OEn)		1µA
IIL(CTRL)Input low current, control pins
(SEL, OEn)		1µA
IIH(HS)Input high current, high speed pins[A/B/C][p/n] VIN = 2V for selected port, A and B with SEL= 0, and A and C with SEL = VCC1µA
[A/B/C][p/n] VIN = 2V for non-selected port, C with SEL= 0, and B with
SEL = VCC
(Note there is a 20KΩ pulldown in non-selected port)		100140µA
IIL(HS)Input low current, high speed pins[A/B/C][p/n]1µA
High Speed Performance
ILDifferential Insertion Lossf = 0.3MHz–0.5dB
f = 2.5GHz–0.7
f = 4GHz–1.1
BW–3dB Bandwidth7.5GHz
RLDifferential return lossf = 0.3MHz–26.4dB
f = 2.5GHz–16.6
f = 4GHz–11.3
OIDifferential OFF isolationf = 0.3MHz–75dB
f = 2.5GHz–22
f = 4GHz–19
XtalkDifferential Crosstalkf = 4GHz–35dB