SLLS983L June   2009  – October 2023 ISO1050

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics - DC Specification
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CAN Bus States
      2. 8.3.2 Digital Inputs and Outputs
      3. 8.3.3 Protection Features
        1. 8.3.3.1 TXD Dominant Time-Out (DTO)
        2. 8.3.3.2 Thermal Shutdown
        3. 8.3.3.3 Undervoltage Lockout and Fail-Safe
        4. 8.3.3.4 Floating Pins
        5. 8.3.3.5 CAN Bus Short-Circuit Current Limiting
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
        2. 9.2.2.2 CAN Termination
      3. 9.2.3 Application Curve
  11. 10Power Supply Recommendations
    1. 10.1 General Recommendations
    2. 10.2 Power Supply Discharging
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-6C31E4D7-9AA7-4974-8200-2561BC66C1B0-low.gifFigure 5-1 16-PinDW PackageTop View
GUID-E2D3F497-5AE5-42A7-AA58-850B5E99EC9D-low.gifFigure 5-2 8-PinDUB PackageTop View
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NAME DW DUB
VCC1 1 1 Supply Digital-side supply voltage (3 to 5.5 V)
GND1 2 — Ground Digital-side ground connection
RXD 3 2 O CAN receive data output (LOW for dominant and HIGH for recessive bus states)
NC 4 — NC No connect
NC 5 — NC No connect
TXD 6 3 I CAN transmit data input (LOW for dominant and HIGH for recessive bus states)
GND1 7 4 Ground Digital-side ground connection
GND1 8 — Ground Digital-side ground connection
GND2 9 5 Ground Transceiver-side ground connection
GND2 10 — Ground Transceiver-side ground connection
NC 11 — NC No connect
CANL 12 6 I/O Low-level CAN bus line
CANH 13 7 I/O High-level CAN bus line
NC 14 — NC No connect
GND2 15 — Ground Transceiver-side ground connection
VCC2 16 8 Supply Transceiver-side supply voltage (5 V)