SNVSC39A February   2023  – September 2023 LM2101

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Start-Up and UVLO
      2. 7.3.2 Input Stages
      3. 7.3.3 Level Shift
      4. 7.3.4 Output Stages
      5. 7.3.5 SH Transient Voltages Below Ground
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select External Bootstrap Diode and Its Series Resistor
        2. 8.2.2.2 Select Bootstrap and GVDD Capacitor
        3. 8.2.2.3 Select External Gate Driver Resistor
        4. 8.2.2.4 Estimate the Driver Power Loss
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20230121-SS0I-ZPCP-TLTT-0XQ00XH8P7MV-low.svg Figure 5-1 D Package, 8-Pin SOIC (Top View)
GUID-20230121-SS0I-BSHH-GSQX-G520RKBQ7J9M-low.svg Figure 5-2 DSG Package, 8-Pin WSON (Top View)
Table 5-1 Pin Functions
PIN DESCRIPTION
NO.(1) NAME TYPE(2)
1

GVDD

 P Gate driver positive supply rail. Locally decouple to ground using low ESR and ESL capacitor located as close to IC as possible.
2

INH

 I High-side control input. The INH input is compatible with TTL and CMOS input thresholds. Unused INH input must be tied to ground and not left open.
3 INL I Low-side control input. The INL input is compatible with TTL and CMOS input thresholds. Unused INL input must be tied to ground and not left open.
4

GND

 G Ground. All signals are referenced to this ground.
5 GL O Low-side gate driver output. Connect to the gate of the low-side MOSFET or one end of external gate resistor, when used.
6 SH P High-side source connection. Connect to the negative terminal of the bootstrap capacitor and to the source of the high-side MOSFET.
7 GH O High-side gate driver output. Connect to the gate of the high-side MOSFET or one end of external gate resistor, when used.
8 BST P High-side gate driver positive supply rail. Connect the positive terminal of the bootstrap capacitor to BST and the negative terminal of the bootstrap capacitor to SH. The bootstrap capacitor must be placed as close to IC as possible.
(1) For 8-pin WSON package, TI recommends that the exposed pad on the bottom of the package be soldered to ground plane on the PCB and the ground plane must extend out from underneath the package to improve heat dissipation.
(2) G = Ground, I = Input, O = Output, and P = Power