SNVS808C May   2012  – Februrary 2016 LM5134

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input-to-Output Logic
        2. 8.2.2.2 Input Threshold Type
        3. 8.2.2.3 VDD Bias Supply Voltage
        4. 8.2.2.4 Peak Source and Sink Currents
        5. 8.2.2.5 Enable and Disable Function
        6. 8.2.2.6 Propagation Delay
        7. 8.2.2.7 PILOT MOSFET Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Pin voltage VDD to VSS −0.3 14 V
IN, INB to VSS −0.3 14
Junction temperature, TJ 150 °C
Storage temperature, Tstg −55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Gate drive supply, VDD 4 12.6 V
Operating junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) LM5134 UNIT
DBV (SOT-23) NGG (WSON)
6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 105.9 51 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 52.1 47 °C/W
RθJB Junction-to-board thermal resistance 21 25.3 °C/W
ψJT Junction-to-top characterization parameter 1.2 0.6 °C/W
ψJB Junction-to-board characterization parameter 20.5 24.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 5.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

TJ = 25°C, VDD = 12 V, unless otherwise specified. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.(1).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
VDD VDD operating voltage TJ = –40°C to +125°C 4 12.6 V
UVLO VDD undervoltage lockout VDD rising TJ = 25°C 3.6 V
TJ = –40°C to +125°C 3.25 4
VDD undervoltage lockout hysteresis 0.36 V
VDD undervoltage lockout to main output delay time VDD rising 500 ns
IDD VDD quiescent current IN = INB = VDD TJ = 25°C 0.8 mA
TJ = –40°C to +125°C 2
OUTPUT
RON-DW (SOT23-6) Main output resistance – pulling down VDD = 10 V, IOUT = –100 mA TJ = 25°C 0.15 Ω
TJ = –40°C to +125°C 0.45
VDD = 4.5 V, IOUT = –100 mA TJ = 25°C 0.2 Ω
TJ = –40°C to +125°C 0.5
RON-DW (WSON) Main output resistance – pulling down VDD = 10 V, IOUT = –100 mA TJ = 25°C 0.2 Ω
TJ = –40°C to +125°C 0.5
VDD = 4.5 V, IOUT = –100 mA TJ = 25°C 0.25 Ω
TJ = –40°C to +125°C 0.55
Power-off pulldown resistance VDD = 0 V, IOUT = –10 mA 1.5 10 Ω
Power-off pulldown clamp voltage VDD = 0 V, IOUT = –10 mA 0.7 1 V
Peak sink current CL = 10,000 pF 7.6 A
RON-UP (SOT23-6) Main output resistance - pulling up VDD = 10 V,
IOUT = 50 mA		 TJ = 25°C 0.7 Ω
TJ = –40°C to +125°C 1.3
VDD = 4.5 V,
IOUT = 50 mA		 TJ = 25°C 1 Ω
TJ = –40°C to +125°C 1.9
RON-UP (WSON) Main output resistance - pulling up VDD = 10 V,
IOUT = 50 mA		 TJ = 25°C 0.75 Ω
TJ = –40°C to +125°C 1.2
VDD = 4.5 V,
IOUT = 50 mA		 TJ = 25°C 1.14 Ω
TJ = –40°C to +125°C 1.85
Peak source current CL = 10,000 pF 4.5 A
PILOT
RONP-DW PILOT output resistance – pulling down VDD = 10 V,
IOUT = –100 mA		 TJ = 25°C 3.7 Ω
TJ = –40°C to +125°C 9
VDD = 4.5 V,
IOUT = –100 mA		 TJ = 25°C 4.7 Ω
TJ = –40°C to +125°C 12
Peak sink current CL = 330 pF 820 mA
RONP-UP PILOT output resistance – pulling up VDD = 10 V,
IOUT = 50 mA		 TJ = 25°C 6 Ω
TJ = –40°C to +125°C 11
VDD = 4.5 V,
IOUT = 50 mA		 TJ = 25°C 10.7 Ω
TJ = –40°C to +125°C 20
Peak source current CL = 330 pF 660 mA
LOGIC INPUT
VIH Logic 1 input voltage LM5134A, TJ = –40°C to +125°C 0.67 × VDD V
LM5134B, TJ = –40°C to +125°C 2.4
VIL Logic 0 input voltage LM5134A, TJ = –40°C to +125°C 0.33 × VDD V
LM5134B, TJ = –40°C to +125°C 0.8
VHYS Logic-input hysteresis LM5134A 0.9 V
LM5134B 0.68
Logic-input current INB = VDD or 0 TJ = 25°C 0.001 µA
TJ = –40°C to +125°C 10
THERMAL RESISTANCE
θJA Junction to ambient SOT23-6 90 °C/W
WSON-6 60 °C/W
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
FOR VDD = +10 V
tR OUT rise time CL = 1000 pF 3 ns
CL = 5000 pF 10
CL = 10,000 pF 20
tF OUT fall time CL = 1000 pF 2 ns
CL = 5000 pF 4.7
CL = 10,000 pF 7.2
tD-ON OUT turnon propagation delay CL = 1000 pF TJ = 25°C 17 ns
TJ = –40°C to +125°C 40
tD-OFF OUT turnoff propagation delay CL = 1000 pF TJ = 25°C 12 ns
TJ = –40°C to +125°C 25
Main output break-before-make time 2.5 ns
tPR PILOT rise time CL = 330 pF 5.3 ns
tPF PILOT fall time CL = 330 pF 3.9 ns
tPD-ON OUT turnoff to PILOT turnon propagation delay CL = 330 pF 4.2 ns
tPD-OFF PILOT turnoff to OUT turnon propagation delay CL = 330 pF 6.4 ns
FOR VDD = +4.5 V
tR Rise time CL = 1000 pF 5 ns
CL = 5000 pF 14
CL = 10,000 pF 24
tF Fall time CL = 1000 pF 2.3 ns
CL = 5000 pF 5.4
CL = 10,00 0pF 7.2
tD-ON OUT turnon propagation delay CL = 1000 pF TJ = 25°C 26 ns
TJ = –40°C to +125°C 50
tD-OFF OUT turnoff propagation delay CL = 1000 pF TJ = 25°C 20 ns
TJ = –40°C to +125°C 45
Main output break-before-make time 4.2 ns
tPR PILOT rise time CL = 330 pF 9.6 ns
tPf PILOT fall time CL = 330 pF 3.7 ns
tPD-ON OUT turnoff to PILOT turnon propagation delay CL = 330 pF 7.5 ns
tPD-OFF PILOT turnoff to OUT turnon propagation delay CL = 330 pF 11.8 ns
LM5134 timingdiag_noninv_input.gif Figure 1. Timing Diagram — Noninverting Input
LM5134 timingdiag_inv_input.gif Figure 2. Timing Diagram — Inverting Input

6.7 Typical Characteristics

LM5134 30192807.png Figure 3. OUT Source Current vs OUT Voltage
LM5134 30192809.png Figure 5. OUT Peak Source Current vs VDD Voltage
LM5134 30192811.png Figure 7. PILOT Source Current vs PILOT Voltage
LM5134 30192813.png Figure 9. PILOT Peak Source Current vs VDD Voltage
LM5134 30192815.png Figure 11. OUT Turnon Propagation Delay vs VDD
LM5134 30192817.png Figure 13. OUT Turnoff to PILOT Turnon Propagation Delay vs VDD
LM5134 30192826.png Figure 15. Supply Current vs OUT Capacitive Load
LM5134 30192828.png Figure 17. Supply Current vs Frequency
LM5134 30192830.png Figure 19. LM5134A Input Threshold vs Temperature
LM5134 30192832.png Figure 21. LM5134B Input Threshold vs Temperature
LM5134 30192835.png Figure 23. UVLO Threshold vs Temperature
LM5134 30192808.png Figure 4. OUT Sink Current vs OUT Voltage
LM5134 30192810.png Figure 6. OUT Peak Sink Current vs VDD Voltage
LM5134 30192812.png Figure 8. PILOT Sink Current vs PILOT Voltage
LM5134 30192814.png Figure 10. PILOT Peak Sink Current vs VDD Voltage
LM5134 30192816.png Figure 12. OUT Turnoff Propagation Delay vs VDD
LM5134 30192818.png Figure 14. PILOT Turnoff to OUT Turnon Propagation Delay vs VDD
LM5134 30192827.png Figure 16. Supply Current vs PILOT Capacitive Load
LM5134 30192829.png Figure 18. Quiescent Current vs Temperature
LM5134 30192831.png Figure 20. LM5134A Input Threshold vs Temperature
LM5134 30192834.png Figure 22. LM5134B Input Threshold vs Temperature