SNOSBQ4F May   1999  – January 2022 LM567C

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics
    5. 7.5 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Center Frequency
      2. 9.3.2 Output Filter
      3. 9.3.3 Loop Filter
      4. 9.3.4 Logic Output
      5. 9.3.5 Die Characteristics
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation With Vi < 200m – VRMS
      2. 9.4.2 Operation With Vi > 200m – VRMS
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Touch-Tone Decoder
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Timing Components
          2. 10.2.1.2.2 Bandwidth
          3. 10.2.1.2.3 Output Filter
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Oscillator with Quadrature Output
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Oscillator with Double Frequency Output
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
      4. 10.2.4 Precision Oscillator Drive 100-mA Loads
        1. 10.2.4.1 Design Requirements
        2. 10.2.4.2 Detailed Design Procedure
        3. 10.2.4.3 Application Curve
      5. 10.2.5 AC Test Circuit
        1. 10.2.5.1 Design Requirements
        2. 10.2.5.2 Detailed Design Procedure
        3. 10.2.5.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Electrical Characteristics

AC Test Circuit, TA = 25°C, V+ = 5 V
PARAMETERTEST CONDITIONSLM567LM567C/LM567CMUNIT
MINTYPMAXMINTYPMAX
Power Supply Voltage Range4.755.09.04.755.09.0V
Power Supply Current QuiescentRL = 20k68710mA
Power Supply Current ActivatedRL = 20k11131215mA
Input Resistance18201520kΩ
Smallest Detectable Input VoltageIL = 100 mA, fi = fo20252025mVrms
Largest No Output Input VoltageIC = 100 mA, fi = fo10151015mVrms
Largest Simultaneous Outband Signal to Inband Signal Ratio66dB
Minimum Input Signal to Wideband Noise RatioBn = 140 kHz−6−6dB
Largest Detection Bandwidth121416101418% of fo
Largest Detection Bandwidth Skew1223% of fo
Largest Detection Bandwidth Variation with Temperature±0.1±0.1%/°C
Largest Detection Bandwidth Variation with Supply Voltage4.75 – 6.75 V±1±2±1±5%V
Highest Center Frequency100500100500kHz
Center Frequency Stability (4.75 – 5.75 V)0 < TA < 70
−55 < TA < +125		35 ± 60
35 ± 140		35 ± 60
35 ± 140		ppm/°C
ppm/°C
Center Frequency Shift with Supply Voltage4.75 V – 6.75 V
4.75 V – 9 V		0.51.0
2.0		0.42.0
2.0		%/V
%/V
Fastest ON-OFF Cycling Ratefo/20fo/20
Output Leakage CurrentV8 = 15 V0.01250.0125µA
Output Saturation Voltageei = 25 mV, I8 = 30 mA
ei = 25 mV, I8 = 100 mA		0.2
0.6		0.4
1.0		0.2
0.6		0.4
1.0		V
Output Fall Time3030ns
Output Rise Time150150ns
(1) The maximum junction temperature of the LM567 and LM567C is 150°C. For operating at elevated temperatures, devices in the DIP package must be derated based on a thermal resistance of 110°C/W, junction to ambient. For the SOIC package, the device must be derated based on a thermal resistance of 160°C/W, junction to ambient.