SNOSBQ4F May   1999  – January 2022 LM567C

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics
    5. 7.5 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Center Frequency
      2. 9.3.2 Output Filter
      3. 9.3.3 Loop Filter
      4. 9.3.4 Logic Output
      5. 9.3.5 Die Characteristics
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation With Vi < 200m – VRMS
      2. 9.4.2 Operation With Vi > 200m – VRMS
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Touch-Tone Decoder
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Timing Components
          2. 10.2.1.2.2 Bandwidth
          3. 10.2.1.2.3 Output Filter
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Oscillator with Quadrature Output
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Oscillator with Double Frequency Output
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
      4. 10.2.4 Precision Oscillator Drive 100-mA Loads
        1. 10.2.4.1 Design Requirements
        2. 10.2.4.2 Detailed Design Procedure
        3. 10.2.4.3 Application Curve
      5. 10.2.5 AC Test Circuit
        1. 10.2.5.1 Design Requirements
        2. 10.2.5.2 Detailed Design Procedure
        3. 10.2.5.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.5 Die Characteristics

GUID-074B0C91-013F-45F0-8EA4-F82408275528-low.pngFigure 9-1 Die Layout (C - Step)
Table 9-1 Die and Wafer Characteristics
Fabrication AttributesGeneral Die Information
Physical Die IdentificationLM567CBond Pad Opening Size (min)91µm x 91µm
Die StepCBond Pad Metalization0.5% COPPER_BAL. ALUMINUM
Physical AttributesPassivationVOM NITRIDE
Wafer Diameter150mmBack Side MetalBARE BACK
Dise Size (Drawn)1600µm x 1626µm
63.0mils x 64.0mils		Back Side ConnectionFloating
Thickness406µm Nominal
Min Pitch198µm Nominal
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
Die Bond Pad Coordinate Locations (C - Step)
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used
SIGNAL NAMEPAD# NUMBERX/Y COORDINATESPAD SIZE
XYXY
OUTPUT FILTER1-67368691x91
LOOP FILTER2-673-41991x91
INPUT3-673-68691x91
V+4-356-68691x91
TIMING RES5673-12291x91
TIMING CAP66737691x91
GND7178686117x91
OUTPUT8-318679117x104