SNLS530D April   2016  – June 2018 LMH1219

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Recommended SMBus Interface AC Timing Specifications
    7. 6.7 Serial Parallel Interface (SPI) AC Timing Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  4-Level Input Configuration Pins
      2. 7.3.2  Input Carrier Detect
      3. 7.3.3  -6 dB Splitter Mode Launch Amplitude for IN0
      4. 7.3.4  Continuous Time Linear Equalizer (CTLE)
        1. 7.3.4.1 Adaptive Cable Equalizer (IN0+)
        2. 7.3.4.2 Adaptive PCB Trace Equalizer (IN1±)
      5. 7.3.5  Input-Output Mux Selection
      6. 7.3.6  Clock and Data Recovery (CDR) Reclocker
      7. 7.3.7  Internal Eye Opening Monitor (EOM)
      8. 7.3.8  Output Function Control
      9. 7.3.9  Output Driver Amplitude and De-Emphasis Control
      10. 7.3.10 Status Indicators and Interrupts
        1. 7.3.10.1 LOCK_N (Lock Indicator)
        2. 7.3.10.2 CD_N (Carrier Detect)
        3. 7.3.10.3 INT_N (Interrupt)
      11. 7.3.11 Additional Programmability
        1. 7.3.11.1 Cable Length Indicator (CLI)
        2. 7.3.11.2 Digital MUTEREF
    4. 7.4 Device Functional Modes
      1. 7.4.1 System Management Bus (SMBus) Mode
        1. 7.4.1.1 SMBus Read and Write Transactions
          1. 7.4.1.1.1 SMBus Write Operation Format
          2. 7.4.1.1.2 SMBus Read Operation Format
      2. 7.4.2 Serial Peripheral Interface (SPI) Mode
        1. 7.4.2.1 SPI Read and Write Transactions
          1. 7.4.2.1.1 SPI Write Transaction Format
          2. 7.4.2.1.2 SPI Read Transaction Format
        2. 7.4.2.2 SPI Daisy Chain
    5. 7.5 LMH1219 Register Map
      1. 7.5.1 Share Register Page
      2. 7.5.2 CTLE/CDR Register Page
      3. 7.5.3 CableEQ/Drivers Register Page
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Guidance for SMPTE and 10 GbE Applications
      2. 8.1.2 Optimizing Time to Adapt and Lock
      3. 8.1.3 LMH1219 and LMH0324 Compatibility
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detail Design Procedure
      3. 8.2.3 Recommended VOD and DEM Register Settings
      4. 8.2.4 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 PCB Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1 Design Requirements

Table 9. LMH1219 Design Requirements

DESIGN PARAMETER REQUIREMENTS
IN0+ Input AC coupling capacitor AC Coupling capacitor at IN0+ should be a 4.7-μF capacitor. Choose a small 0402 surface mount ceramic capacitor. IN0- should be AC terminated with 4.7 μF and 75 Ω to VSS.
IN1± Input AC coupling capacitors AC Coupling capacitors at IN1± should be 4.7-μF capacitors. Choose small 0402 surface mount ceramic capacitors. This allows both SMPTE and 10 GbE data traffic.
Output AC coupling capacitors Both OUT0± and OUT1± require AC coupling capacitors. Choose small 0402 surface mount ceramic capacitors. 4.7-μF AC coupling capacitors are recommended.
DC power supply decoupling capacitors Decoupling capacitors are required to minimize power supply noise. Place 10-μF and 1-μF bulk capacitors close to each device. Place a 0.1-μF capacitor close to each supply pin.
VDD_LDO decoupling capacitors Place 1-μF and 0.1-μF surface mount ceramic capacitors as close as possible to the device VDD_LDO pin.
High speed board trace for IN0 IN0+ and IN0- should be routed with uncoupled board traces with 75-Ω characteristic impedance.
High Speed IN1, OUT0, and OUT1 trace impedance IN1±, OUT0± and OUT1± should be routed with coupled board traces with 100-Ω differential impedance.
SMPTE return loss Place BNC within 1 inch of the LMH1219 and consult BNC vendor for recommended BNC landing pattern to meet SMPTE requirements.
IN0+ and IN1± cross talk When a long length coax cable is connected to IN0+, the signal amplitude at IN0+ can be just a few mVp-p. Layout precautions must be taken to minimize crosstalk from adjacent devices or from adjacent input port IN1±. To reduce cross coupling effects, keep IN1± traces as far from IN0± as possible. When IN1± is not used, it is recommended to turn off the signal source to IN1± for best results.
Use of SPI or SMBus interface Set MODE_SEL to Level-F (pin unconnected) for SPI. Set MODE_SEL to Level-L (connect 1 kΩ to VSS) for SMBus. SMBus is 3.3 V tolerant.