SDLS967H may   2016  – july 2023 LSF0108-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information (Q1)
    5. 6.5 Electrical Characteristics - RKS Package
    6. 6.6 Electrical Characteristics - PW Package
    7. 6.7 Switching Characteristics (Translating Down)
    8. 6.8 Switching Characteristics (Translating Up)
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Auto Bidirectional Voltage Translation
      2. 8.3.2 Output Enable
      3. 8.3.3 Wettable Flanks
    4. 8.4 Device Functional Modes
      1. 8.4.1 Up and Down Translation
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 I2C PMBus, SMBus, GPIO
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Enable, Disable, and Reference Voltage Guidelines
          2. 9.2.1.1.2 Bias Circuitry
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Bidirectional Translation
          2. 9.2.1.2.2 Pull-Up Resistor Sizing
          3. 9.2.1.2.3 LSF0108-Q1 Bandwidth
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Mixed-Mode Voltage Translation
        1. 9.2.2.1 Single Supply Translation
        2. 9.2.2.2 Voltage Translation for Vref_B < Vref_A + 0.8 V
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
9.2.1.2.1 Bidirectional Translation

For the bidirectional clamping configuration (higher voltage to lower voltage or lower voltage to higher voltage), the EN input must be connected to Vref_B and both pins pulled to HIGH side VCCB through a bias resistor (typically 200 kΩ). This allows Vref_B to regulate the EN input. A filter capacitor on Vref_B is recommended. The controller output driver can be push-pull or open-drain (pull-up resistors may be required) and the peripheral device output can be push-pull or open-drain (pull-up resistors are required to pull the Bn outputs to VPU).

Note: If either output is push-pull, then data must be unidirectional or the outputs must be tri-state and be controlled by some direction-control mechanism to prevent HIGH-to-LOW contentions in either direction. If both outputs are open-drain, then no direction control is needed.

Figure 9-1 shows how the reference supply voltage Vref_A is connected to the processor core power supply at 1.8 V and Vref_B is connected through a 200 kΩ resistor to a 5 V power supply. The output of A3 and B4 has a maximum output voltage equal to Vref_A, and the bidirectional interface (Ch5/6, MDIO, MDC) has a maximum output voltage equal to Vpu.