SBOS940A May   2019  – March 2020 OPA818

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     High-Speed Optical Front-End
  3. 3 Description
    1.     Photodiode Capacitance vs 3-dB Bandwidth
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±5 V
    6. 7.6 Typical Characteristics: VS = ±5 V
    7. 7.7 Typical Characteristics: VS = 6 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input and ESD Protection
      2. 8.3.2 Feedback Pin
      3. 8.3.3 Decompensated Architecture With Wide Gain-Bandwidth Product
      4. 8.3.4 Low Input Capacitance
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply Operation (+4/–2 V to ±6.5 V)
      2. 8.4.2 Single-Supply Operation (6 V to 13 V)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Wideband, Non-Inverting Operation
      2. 9.1.2 Wideband, Transimpedance Design Using OPA818
    2. 9.2 Typical Applications
      1. 9.2.1 High Bandwidth, 100-kΩ Gain Transimpedance Design
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Non-Inverting Gain of 2 V/V
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.