SCPS146G October   2005  – March 2021 PCA9544A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Interrupt Timing Requirements
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
    6. 8.6 Register Map
      1. 8.6.1 Control Register
        1. 8.6.1.1 Device Address
        2. 8.6.1.2 Control Register Description
        3. 8.6.1.3 Control Register Definition
        4. 8.6.1.4 Interrupt Handling
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)PCA9544AUNIT
DGVDWPWRGY
20 PINS20 PINS20 PINS20 PINS
RθJAJunction-to-ambient thermal resistance9258118.262.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance43.941.9

62.7

60.5°C/W
RθJBJunction-to-board thermal resistance64.540.3

69.3

39.5°C/W
ψJTJunction-to-top characterization parameter4.218.17.77.2°C/W
ψJBJunction-to-board characterization parameter63.640

68.8

39.8°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistancen/an/an/a26.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.