SLPS755A October   2023  – December 2023 RES11A-Q1

ADVMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 AEC-Q200 Qualification Testing
    7. 5.7 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 DC Measurement Configurations
    2. 6.2 AC Measurement Configurations
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Ratiometric Matching
      2. 7.3.2 Ratiometric Drift
      3. 7.3.3 Predictable Voltage Coefficient
      4. 7.3.4 Ultra-Low Noise
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Discrete Difference Amplifier
        1. 8.1.1.1 Difference-Amplifier Common-Mode Rejection Analysis
      2. 8.1.2 Discrete Instrumentation Amplifiers
        1. 8.1.2.1 Instrumentation Amplifier Common-Mode Rejection Analysis
      3. 8.1.3 Fully Differential Amplifier
    2. 8.2 Typical Application
      1. 8.2.1 Common-Mode Shifting Input Stage
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 9.1.1.3 TI Reference Designs
        4. 9.1.1.4 Filter Design Tool
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDF|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

at TA = 25°C (unless otherwise noted)

GUID-20231209-SS0I-PW3B-BS2J-2GPLMZDLRMZR-low.svg
RES11A40-Q1 n = 1411, 1 lot
Figure 5-1 tD1 Distribution
GUID-20231209-SS0I-FTW6-9DT9-6NG7TWQLPS7V-low.svg
RES11A40-Q1 n = 1411, 1 lot
Figure 5-3 tM Distribution
GUID-20231206-SS0I-SPRR-RLBG-GBLKGC8D7PJR-low.svg
 
Figure 5-5 Maximum Power Dissipation
GUID-20231212-SS0I-65QP-LS0T-XB1ZQCRZ8KLX-low.svg
RES11A40-Q1
Figure 5-7 RINx vs Temperature
GUID-20231212-SS0I-R2VJ-KDXJ-VF1GKQQZ7R76-low.svg
RES11A40-Q1
Figure 5-9 tD1 vs Temperature
GUID-20231212-SS0I-WZ7B-PGCB-JJG6C7DC2X18-low.svg
RES11A40-Q1 n = 92
Figure 5-11 tD1 Drift Distribution
GUID-20231212-SS0I-MRGQ-XNDN-PH7MKM6DWKR6-low.svg
RES11A40-Q1
Figure 5-13 tM vs Temperature
GUID-20231215-SS0I-2CR8-CDLP-DLLQBDKNZ9W1-low.svg
RES11A40-Q1 Normalized to Rx(5V)
Figure 5-15 RINx vs Bias
GUID-20231215-SS0I-X8DS-ZWTX-KCBWX3NWPNQ5-low.svg
RES11A40-Q1 RINx actual – RINx predicted, normalized to Rx(5V)
Figure 5-17 RINx Actual-to-Expected Mismatch Error vs Bias
GUID-20231215-SS0I-GDMK-NN3T-JCHMXWJTHMJX-low.svg
RES11A40-Q1 Normalized to tDx(5V)
Figure 5-19 tDx vs Bias
GUID-20231120-SS0I-8VKJ-KMNW-K65MCDWKJ4Q9-low.svg
RES11A40-Q1 VRINx = VTEST, VRGx = 0 V
Figure 5-21 Bandwidth vs Frequency, RINx
GUID-20231120-SS0I-JGB8-JWMF-LDT6B1WLDG0T-low.svg
RES11A40-Q1
Figure 5-23 Crosstalk vs Frequency
GUID-20231209-SS0I-F1GB-2FVX-XDHT94Q9GPJR-low.svg
RES11A40-Q1 n = 1411, 1 lot
Figure 5-2 tD2 Distribution
GUID-20231209-SS0I-4CNM-NVFS-MXBZDKLCSBDD-low.svg
RES11A40-Q1 n = 1411, 1 lot
Figure 5-4 Absolute Tolerance Span Distribution
GUID-20231212-SS0I-CDZP-HG1H-8BLSPWHBHTH0-low.svg
RES11A40-Q1
Figure 5-6 Rx2 – Rx1 vs Temperature
GUID-20231212-SS0I-VNHN-H81L-SCPXLB8BPXRJ-low.svg
RES11A40-Q1
Figure 5-8 RGx vs Temperature
GUID-20231212-SS0I-TTV8-4R1G-FH1WLQSMWCPC-low.svg
RES11A40-Q1
Figure 5-10 tD2 vs Temperature
GUID-20231212-SS0I-QPTH-KJSC-JQFKXB9FMPTF-low.svg
RES11A40-Q1 n = 96
Figure 5-12 tD2 Drift Distribution
GUID-20231212-SS0I-45TV-SLDN-GV1JX2NWXJ9G-low.svg
RES11A40-Q1 n = 95
Figure 5-14 tM Drift Distribution
GUID-20231215-SS0I-DLPT-4KLM-K2VSMC1CBRGS-low.svg
RES11A40-Q1 Normalized to Rx(5V)
Figure 5-16 RGx vs Bias
GUID-20231215-SS0I-8PGG-WLVW-ZXBCDLVRN3LW-low.svg
RES11A40-Q1 RGx actual – RGx predicted, normalized to Rx(5V)
Figure 5-18 RGx Actual-to-Expected Mismatch Error vs Bias
GUID-20231215-SS0I-TXLH-NG2X-DFT6BJDD82XC-low.svg
RES11A40-Q1 Normalized to tM(5V)
Figure 5-20 tM vs Bias
GUID-20231120-SS0I-GZLM-HJ5F-2K4MZDGZWC9F-low.svg
RES11A40-Q1 VRGx = VTEST, VRINx = 0 V
Figure 5-22 Bandwidth vs Frequency, RGx
GUID-20231213-SS0I-XLFD-1L4M-GNZN1ZDB9JPN-low.svg
RES11A40-Q1 Difference amplifier with OPA210
Figure 5-24 CMRR vs Frequency