SLPS755A October   2023  – December 2023 RES11A-Q1

ADVMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 AEC-Q200 Qualification Testing
    7. 5.7 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 DC Measurement Configurations
    2. 6.2 AC Measurement Configurations
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Ratiometric Matching
      2. 7.3.2 Ratiometric Drift
      3. 7.3.3 Predictable Voltage Coefficient
      4. 7.3.4 Ultra-Low Noise
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Discrete Difference Amplifier
        1. 8.1.1.1 Difference-Amplifier Common-Mode Rejection Analysis
      2. 8.1.2 Discrete Instrumentation Amplifiers
        1. 8.1.2.1 Instrumentation Amplifier Common-Mode Rejection Analysis
      3. 8.1.3 Fully Differential Amplifier
    2. 8.2 Typical Application
      1. 8.2.1 Common-Mode Shifting Input Stage
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 9.1.1.3 TI Reference Designs
        4. 9.1.1.4 Filter Design Tool
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDF|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Ultra-Low Noise

Noise in resistors can be evaluated in two separate regions: low-frequency flicker noise and wideband thermal noise. Flicker, or 1/f noise, is extremely important for systems that require signal gain at frequencies less than 100 Hz. Thermal noise typically dominates in the region greater than 1 kHz, and increases as resistor magnitude increases. Noise is modeled as a voltage source in series with the resistor.

For a resistive divider such as the RES11A-Q1, the thermal noise as measured at the center tap of two resistors, RIN and RG, is equivalent to the thermal noise of a resistor with value RIN || RG:

Equation 11. e N = 4 k B T R

where:

  • eN is the thermal noise density in nV/√Hz
  • T is the absolute temperature in kelvins (K)
  • kB is the Boltzmann constant, 1.381 × 10-23 J/K
  • R = RIN || RG

As an example, for the RES11A40-Q1 at 25°C:

Equation 12. e N = 4 k B T R = 4 × 1.38 E - 23 J K × 278   K × 1   k     4   k = 3.5   n V / H z