SLLS666F September   2005  – March 2023 SN65HVD50 , SN65HVD52 , SN65HVD53 , SN65HVD54 , SN65HVD55

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Available Options
  6. 6 Pin Configurations
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Electrostatic Discharge Protection
    4. 7.4 Driver Electrical Characteristics
    5. 7.5 Driver Switching Characteristics
    6. 7.6 Receiver Electrical Characteristics
    7. 7.7 Receiver Switching Characteristics
    8. 7.8 Thermal Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Device Information
    1. 9.1 Ll-Power Standby Mode
    2. 9.2 Function Tables
    3. 9.3 Equivalent Input and Output Schematic Diagrams
  10. 10Application and Implementation
    1. 10.1 Thermal Characteristics of IC Packages
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3 Electrostatic Discharge Protection

PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
Human body model Bus terminals and GND ±16 kV
Human body model(2) All pins ±4
Charged-device-model(3) All pins ±1
(1) All typical values at 25°C and with a 5-V supply.
(2) Tested in accordance with JEDEC Standard 22, Test Method A114-A.
(3) Tested in accordance with JEDEC Standard 22, Test Method C101.