4 Revision History
Changes from Revision B (January 2023) to Revision C (July 2023)
- Updated thermal values for DCK package from RθJA = 252 to 293.4, all
values in °C/WGo
Changes from Revision A (June 2003) to Revision B (January 2023)
- Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go