SCES551F February   2004  – March 2024 SN74AVC16T245

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: VCCA = 1.2 V
    7. 6.7  Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    8. 6.8  Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    9. 6.9  Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    10. 6.10 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    11. 6.11 Operating Characteristics
    12. 6.12 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.2-V to 3.6-V Power-Supply Range
      2. 8.3.2 Partial-Power-Down Mode Operation
      3. 8.3.3 VCC Isolation
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Enable Times
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Voltage Ranges
        2. 9.2.2.2 Output Voltage Range
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
      2. 10.1.2 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)SN74AVC16T245UNIT
DGV
(TVSOP)		DGG
(TSSOP)		ZQL
(BGA MICROSTAR JUNIOR)
48 PINS48 PINS56 PINS
RθJAJunction-to-ambient thermal resistance82.569.964.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance34.223.916.6°C/W
RθJBJunction-to-board thermal resistance45.136.630.8°C/W
ψJTJunction-to-top characterization parameter2.71.70.9°C/W
ψJBJunction-to-board characterization parameter44.636.264.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.