SCLS427J April   1999  – February 2024 SN74LV4066A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information: SN74LV4066A
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics (LV)
    6. 5.6 Timing Characteristics VCC = 2.5V ± 0.2V
    7. 5.7 Timing Characteristics VCC = 3.3V ± 0.3V
    8. 5.8 Timing Characteristics VCC = 5V ± 0.5V
    9. 5.9 AC Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • RGY|14
  • DB|14
  • DGV|14
  • PW|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information: SN74LV4066A

THERMAL METRIC(1) SN74LV4066A  UNIT
D (SOIC) PW (TSSOP) RGY (VQFN)
14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance  128.8 150.6 91.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 81.8 78.2 91.8 °C/W
RθJB Junction-to-board thermal resistance 84.2 93.7 66.5 °C/W
ΨJT Junction-to-top characterization parameter 39.5 24.6 20.0 °C/W
ΨJB Junction-to-board characterization parameter 83.7 93.1 66.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 50.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.