SCES677E September   2006  – December 2022 SN74LVC1T45-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: VCCA = 1.8 V ±0.15 V
    7. 6.7  Switching Characteristics: VCCA = 2.5 V ±0.2 V
    8. 6.8  Switching Characteristics: VCCA = 3.3 V ±0.3 V
    9. 6.9  Switching Characteristics: VCCA = 5 V ±0.5 V
    10. 6.10 Typical Characteristics
      1.      Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1.      Application and Implementation
        1. 8.1 Application Information
          1. 8.1.1 Enable Times
        2. 8.2 Typical Applications
          1. 8.2.1 Unidirectional Logic Level-Shifting Application
            1. 8.2.1.1 Design Requirements
            2. 8.2.1.2 Detailed Design Procedure
            3. 8.2.1.3 Application Curves
          2. 8.2.2 Bidirectional Logic Level-Shifting Application
            1. 8.2.2.1 Detailed Design Procedure
            2. 8.2.2.2 Application Curves
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)SN74LVC1T45-Q1UNIT
DCK (SC70)
6 PINS
RθJAJunction-to-ambient thermal resistance210.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance139.2°C/W
RθJBJunction-to-board thermal resistance72°C/W
ψJTJunction-to-top characterization parameter54.9°C/W
ψJBJunction-to-board characterization parameter71.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance—°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.