SLASF29 January   2022 TAA5242

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 6.7 Switching Characteristics: TDM, I2S or LJ Interface
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Hardware Control
      2. 8.3.2 Audio Serial Interfaces
        1. 8.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 8.3.2.2 Inter IC Sound (I2S) Interface
      3. 8.3.3 Analog Input Configurations
      4. 8.3.4 Reference Voltage
    4. 8.4 Device Functional Modes
      1. 8.4.1 Active Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
  11. 10Power Supply Recommendations
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TAA5242 UNIT
RGE (WQFN)
28 PINS
RθJA Junction-to-ambient thermal resistance 38.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 26.3 °C/W
RθJB Junction-to-board thermal resistance 15.9 °C/W
ψJT Junction-to-top characterization parameter 0.5 °C/W
ψJB Junction-to-board characterization parameter 15.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 13.8 °C/W
(1) For more information about traditional and new thermal metrics, see the spra953 application report.