SLASF28 December   2023 TAC5142

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 6.7 Switching Characteristics: TDM, I2S or LJ Interface
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Hardware Control
      2. 8.3.2 Audio Serial Interfaces
        1. 8.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 8.3.2.2 Inter IC Sound (I2S) Interface
      3. 8.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 8.3.4 Analog Input Output Configurations
      5. 8.3.5 Reference Voltage
      6. 8.3.6 ADC Signal-Chain
        1. 8.3.6.1 Digital High-Pass Filter
        2. 8.3.6.2 Configurable Digital Decimation Filters
          1. 8.3.6.2.1 Linear Phase Filters
            1. 8.3.6.2.1.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.6.2.1.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.6.2.1.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.6.2.1.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.6.2.1.5 Sampling Rate: 96 kHz or 88.2 kHz
      7. 8.3.7 DAC Signal-Chain
        1. 8.3.7.1 Configurable Digital Interpolation Filters
          1. 8.3.7.1.1 Linear Phase Filters
            1. 8.3.7.1.1.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.7.1.1.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.7.1.1.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.7.1.1.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.7.1.1.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.7.1.1.6 Sampling Rate: 384 kHz or 352.8 kHz
    4. 8.4 Device Functional Modes
      1. 8.4.1 Active Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
  11. 10Power Supply Recommendations
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over the operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage AVDD to AVSS –0.3 3.9 V
Supply voltage IOVDD to VSS (thermal pad) –0.3 3.9 V
Ground voltage differences AVSS to VSS (thermal pad) –0.3 0.3 V
Analog input voltage Analog input pins voltage to AVSS –0.3 AVDD+0.3 V
Digital input voltage Digital input pins voltage to VSS (thermal pad) –0.3 IOVDD + 0.3 V
Temperature Functional ambient, TA -55 125 °C
Operating ambient, TA –40 125
Junction, TJ –40 150
Storage, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.