SLASF32 December   2023 TAD5142

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 5.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hardware Control
      2. 7.3.2 Audio Serial Interfaces
        1. 7.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 7.3.2.2 Inter IC Sound (I2S) Interface
      3. 7.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 7.3.4 Analog Output Configurations
      5. 7.3.5 Reference Voltage
      6. 7.3.6 DAC Signal-Chain
        1. 7.3.6.1 Configurable Digital Interpolation Filters
          1. 7.3.6.1.1 Linear Phase Filters
            1. 7.3.6.1.1.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 7.3.6.1.1.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 7.3.6.1.1.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 7.3.6.1.1.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 7.3.6.1.1.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 7.3.6.1.1.6 Sampling Rate: 384 kHz or 352.8 kHz
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
  10. 9 Power Supply Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.