SLASF32 December   2023 TAD5142

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 5.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hardware Control
      2. 7.3.2 Audio Serial Interfaces
        1. 7.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 7.3.2.2 Inter IC Sound (I2S) Interface
      3. 7.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 7.3.4 Analog Output Configurations
      5. 7.3.5 Reference Voltage
      6. 7.3.6 DAC Signal-Chain
        1. 7.3.6.1 Configurable Digital Interpolation Filters
          1. 7.3.6.1.1 Linear Phase Filters
            1. 7.3.6.1.1.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 7.3.6.1.1.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 7.3.6.1.1.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 7.3.6.1.1.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 7.3.6.1.1.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 7.3.6.1.1.6 Sampling Rate: 384 kHz or 352.8 kHz
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
  10. 9 Power Supply Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Recommended Operating Conditions

MIN NOM MAX UNIT
POWER
AVDD(1) Analog supply voltage to AVSS AVDD-3.3V Operation 3.0 3.3 3.6 V
AVDD(1) Analog supply voltage to AVSS - AVDD 1.8V operation 1.65 1.8 1.95 V
IOVDD IO supply voltage to VSS (thermal pad) - IOVDD 3.3-V operation 3.0 3.3 3.6 V
IO supply voltage to VSS (thermal pad) - IOVDD 1.8-V operation 1.65 1.8 1.95
IOVDD IO supply voltage to VSS (thermal pad) - IOVDD 1.2-V operation 1.08 1.2 1.32 V
INPUTS
INxx Analog input pins voltage to AVSS for line-in recording 0 AVDD V
INxx Analog input pins voltage to AVSS for microphone recording 0.1 MICBIAS – 0.1 V
IO Digital input pins(except MD0) voltage to VSS (thermal pad) 0 IOVDD V
MD0 MD0 pin w.r.t AVSS 0 AVDD V
TEMPERATURE
TA Operating ambient temperature –40 125 °C
OTHERS
MD3 clock frequency (in controller mode) 36.864(2) MHz
CL Digital output load capacitance 20 50 pF
(1) AVSS and VSS (thermal pad); all ground pins must be tied together and must not differ in voltage by more than 0.2 V.
(2) MCLK input rise time (VIL to VIH) and fall time (VIH to VIL) must be less than 5 ns. For better audio noise performance, MCLK input  must be used with low jitter.