SBVS292C July   2016  – June 2018

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit (Fixed-Voltage Versions)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with VIN Less Than 2 V
      2. 7.4.2 Operation with VIN Greater Than 2 V
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Requirements
      2. 8.1.2 Transient Response
      3. 8.1.3 Thermal Protection
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitance
        2. 8.2.2.2 Output Capacitance
        3. 8.2.2.3 Thermal Calculation
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Board Layout Recommendations to Improve PSRR and Noise Performance
    3. 10.3 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

at TA = –40°C to +125°C, VIN = VOUT(TYP) + 0.3 V or 2 V (whichever is greater), IOUT = 10 mA, VEN = VIN, and COUT = 1 µF (unless otherwise noted); typical values are at TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range 2 5.5 V
VOUT DC output accuracy –40°C ≤ TA ≤ +125°C, VOUT ≥ 1 V –2% 2%
ΔVO/ΔVIN Line regulation VOUT(NOM) + 0.5 V ≤ VIN ≤ 5.5 V,
IOUT = 10 mA		 1 5 mV
ΔVO/ΔIOUT Load regulation 0 mA ≤ IOUT ≤ 200 mA 15 mV
VDO Dropout voltage(1) VIN = 0.98 × VOUT(NOM), IOUT = 200 mA 175 250 mV
ICL Output current limit VOUT = 0.9 × VOUT(NOM) 220 350 860 mA
IGND Ground pin current IOUT = 0 mA 31 55 µA
IOUT = 200 mA, VIN = VOUT + 0.5 V 270
ISHDN Ground pin current (shutdown) VEN ≤ 0.4 V, 2.0 V ≤ VIN ≤ 4.5 V 1 2.5 µA
PSRR Power-supply rejection ratio VIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA,
f = 1 kHz		 68 dB
VN Output noise voltage BW = 100 Hz to 100 kHz, VIN = 2.3 V,
VOUT = 1.8 V, IOUT = 10 mA		 48 µVRMS
tSTR Startup time(2) COUT = 1 µF, IOUT = 200 mA 100 µs
VEN(HI) Enable pin high (enabled) 0.9 VIN V
VEN(LO) Enable pin low (disabled) 0 0.4 V
IEN Enable pin current VEN = 5.5 V , IOUT = 10 µA 0.04 0.5 µA
UVLO Undervoltage lockout VIN rising 1.9 V
TSD Thermal shutdown temperature Shutdown, temperature increasing 160 °C
Reset, temperature decreasing 140
TA Operating ambient temperature –40 125 °C
(1) VDO is measured for devices with VOUT(NOM) ≥ 2.35 V.
(2) Startup time = time from EN assertion to 0.98 × VOUT(NOM).