SBVS401A June 2020 – December 2020 TLV740P
PRODUCTION DATA
PIN | I/O | DESCRIPTION | ||
---|---|---|---|---|
NAME | NO. | |||
X2SON | SOT-23 | |||
EN | 3 | 3 | I | Enable pin. Driving this pin to logic high enables the device; driving this pin to logic low disables the device. Do not float this pin. If not used, connect EN to IN. |
GND | 2 | 2 | — | Ground pin. This pin must be connected to ground on the board. |
IN | 4 | 1 | I | Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground; see the Recommended Operating Conditions table. Place the input capacitor as close to the input of the device as possible. |
NC | — | 4 | — | No connect pin. This pin is not internally connected. Connect to ground for best thermal performance or leave floating. |
OUT | 1 | 5 | O | Regulated output pin. A 1-µF or greater effective capacitance is required from OUT to ground for stability. see the Recommended Operating Conditions table. For best transient response, use a 1-µF or larger ceramic capacitor from OUT to ground. Place the output capacitor as close to output of the device as possible. |
Thermal pad | — | — | The thermal pad is electrically connected to the GND pin. Connect the thermal pad to a large-area GND plane for improved thermal performance. |