Circuit reliability demands that proper consideration is given to device power dissipation, location of the circuit on the printed circuit board (PCB), and correct sizing of the thermal plane. Make sure the PCB area around the regulator is as free of other heat-generating devices as possible that cause added thermal stresses.

As a first-order approximation, power dissipation in the regulator depends on the input-to-output voltage difference and load conditions. Use Equation 2 to approximate P_D:

Minimize power dissipation to achieve greater efficiency. This minimizing process is achieved by selecting the correct system voltage rails. Proper selection helps obtain the minimum input-to-output voltage differential. The low dropout of the device allows for maximum efficiency across a wide range of output voltages.

The main heat conduction path for the device is through the thermal pad on the package. As such, solder the thermal pad to a copper pad area under the device. Make sure this pad area contains an array of plated vias that conduct heat to inner plane areas or to a bottom-side copper plane.

The maximum allowable junction temperature (T_J) determines the maximum power dissipation for the device. Power dissipation and junction temperature are most often related by the junction-to-ambient thermal resistance (R_θJA) of the combined PCB, device package, and the temperature of the ambient air (T_A), according to Equation 3.

Unfortunately, this thermal resistance (R_θJA) is dependent on the heat-spreading capability built into the particular PCB design, and therefore varies according to the total copper area, copper weight, and location of the planes. The R_θJA value is only used as a relative measure of package thermal performance. R_θJA is the sum of the WSON package junction-to-case (bottom) thermal resistance (R_θJCbot) plus the thermal resistance contribution by the PCB copper.