SBVS322C October 2017 – March 2024 TLV757P
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
The JEDEC standard recommends the use of psi (Ψ) thermal metrics to estimate the junction temperatures of the LDO when in-circuit on a typical PCB board application. These metrics are not thermal resistances, but offer practical and relative means of estimating junction temperatures. These psi metrics are independent of the copper-spreading area. The key thermal metrics (ΨJT and ΨJB) are shown in the Thermal Information table and are used in accordance with Equation 4.
where: