SLASF51 February   2024 TMUXHS4446

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 High-Speed Performance Parameters
    7. 5.7 Switching Characteristics
    8. 5.8 I2C Timing Characteristics
    9. 5.9 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 High-Speed Differential Signal Switching
      2. 6.3.2 Low-Speed SBU Signal Switching
      3. 6.3.3 GPIO and I2C Control Modes
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application: USB-C with DP Alternate Mode - Source
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Design Requirements

For this design example, use the parameters shown in Table 7-1.

Table 7-1 Design Parameters
PARAMETERVALUE
Supply voltage, VCC3.3V
AC coupling capacitors for TX pins on USB-C connector side, CTX220nF
I2C pullup resistor, RI2C2kΩ
I2C pullup voltage, VI2C3.3V
DP Auxiliary channel pullup voltage, DP_PWR 3.3V
DP Auxiliary channel coupling capacitor, CAUX 100nF