SNAS681A February   2017  – September 2021 TPL5110-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Ratings
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DRV
      2. 7.3.2 DONE
    4. 7.4 Device Functional Modes
      1. 7.4.1 Start-Up
      2. 7.4.2 Timer Mode
      3. 7.4.3 One-Shot Mode
    5. 7.5 Programming
      1. 7.5.1 Configuring the Time Interval with the DELAY/M_DRV Pin
      2. 7.5.2 Manual MOSFET Power ON Applied to the DELAY/M_DRV Pin
        1. 7.5.2.1 DELAY/M_DRV
        2. 7.5.2.2 Circuitry
      3. 7.5.3 Selection of the External Resistance
      4. 7.5.4 Quantization Error
      5. 7.5.5 Error Due to Real External Resistance
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Specifications are for TA= 25°C, VDD-GND=2.5 V, unless otherwise stated.(1)
PARAMETERTEST CONDITIONSMIN(2)TYP(3)MAX(2)UNIT
POWER SUPPLY
IDDSupply current(4)Operation mode3550nA
Digital conversion of external resistance (Rext)200400µA
TIMER
tIPTime interval Period(5)1650 selectable Time intervalsMin time interval100ms
Max time interval7200s
Time interval Setting Accuracy(7)Excluding the precision of Rext±0.6%
Time interval Setting Accuracy over supply voltage1.8V ≤ VDD ≤ 5.5V±25ppm/V
tOSCOscillator Accuracy–0.5%0.5%
Oscillator Accuracy over temperature(5)–40°C ≤ TA≤ 125°C150ppm/°C
Oscillator Accuracy over supply voltage(5)1.8V ≤ VDD ≤ 5.5V±0.4%/V
Oscillator Accuracy over life time(6)±0.24%
tDONEMinimum DONE Pulse width (5)100ns
tDRVDRV Pulse widthDONE signal not receivedtIP–50ms
t_RextTime to convert Rext (5)100ms
DIGITAL LOGIC LEVELS
VIHMinimum Logic High Threshold DONE pin0.7xVDDV
VILMaximum Logic Low Threshold DONE pin0.3xVDDV
VOHLogic output High Level DRV pinIout = 100 µAVDD–0.3V
Iout = 1 mAVDD–0.7V
VOLLogic output Low Level DRV pinIout = –100 µA0.3V
Iout = –1 mA0.7V
VIHM_DRVMinimum Logic High Threshold DELAY/M_DRV pin (5)1.5V
(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically.
(2) Limits are specified by testing, design, or statistical analysis at 25°C. Limits over the operating temperature range are specified through correlations using statistical quality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped production material.
(4) The supply current excludes load and pull-up resistor current. Input pins are at GND or VDD.
(5) This parameter is specified by design and/or characterization and is not tested in production.
(6) Operational life time test procedure equivalent to10 years.
(7) The accuracy for time interval settings below 1second is ±100ms.