SLVSDX2A September   2017  – December 2017 TPS23521

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Relationship between Sense Voltage, Gate Current, and Timer
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Current Limit
        1. 8.3.1.1 Programming the CL Switch-Over Threshold
        2. 8.3.1.2 Setting Up the PROG Pin
        3. 8.3.1.3 Programming CL1
        4. 8.3.1.4 Programming CL2
      2. 8.3.2 Soft Start Disconnect
      3. 8.3.3 Timer
      4. 8.3.4 Gate 2
    4. 8.4 Device Functional Modes
      1. 8.4.1 OFF State
      2. 8.4.2 Insertion Delay State
      3. 8.4.3 Start-up State
      4. 8.4.4 Normal Operation State
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting RSNS
        2. 9.2.2.2 Selecting Soft Start Setting: CSS and CSS,VEE
        3. 9.2.2.3 Selecting VDS Switch Over Threshold
        4. 9.2.2.4 Timer Selection
        5. 9.2.2.5 MOSFET Selection and SOA Checks
        6. 9.2.2.6 EMI Filter Consideration
        7. 9.2.2.7 Under Voltage and Over Voltage Settings
        8. 9.2.2.8 Choosing RVCC and CVCC
        9. 9.2.2.9 Power Good Interface to Downstream DC/DC
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1 Design Requirements

The table below summarizes the design parameters that must be known before designing a hot swap circuit. When charging the output capacitor through the hot swap MOSFET, the FET’s total energy dissipation equals the total energy stored in the output capacitor (1/2CV2). Thus both the input voltage and output capacitance will determine the stress experienced by the MOSFET. The maximum load power will drive the current limit and sense resistor selection. In addition, the maximum load current, maximum ambient temperature, and the thermal properties of the PCB (RθCA) will drive the selection of the MOSFET's RDSON and the number of MOSFETs used. RθCA is a strong function of the layout and the amount of copper that is connected to the drain of the MOSFET. Air cooling will also reduce RθCA substantially. Finally, it's important to know what transients the circuit has to pass in order to size up the input protection accordingly.

Table 1. Design Requirements for a –38 V to –60 V, 400-W Protection Circuit

DESIGN PARAMETER EXAMPLE VALUE
Input voltage range –36 V to –72 V
Maximum Load Power 1200 W
Output Capacitance 4 x 330 µF
Location of Output Cap After EMI filter.
Maximum Ambient Temperature 65°C
MOSFET RθCA (function of layout) 20°C/W
Pass “Hot-Short” on Output? Yes
Pass a “Start into short”? Yes
Is the load off until PG asserted? Yes