VIN and PGND traces must be as wide as possible to reduce trace impedance and improve heat dissipation.
At least 1 µF of input capacitance is required on both VIN pins of the IC and must be placed as close as possible to the IC. The input capacitors must connect directly to the adjacent PGND pins.
Connect the PGND pins on both sides of the IC to the thermal pad with a trace as wide as possible to reduce trace impedance and improve heat dissipation.
The PGND trace between the output capacitor and the PGND pin must be as wide as possible to minimize its trace impedance.
Provide sufficient vias for the input capacitor and output capacitor.
Keep the SW trace as physically short and wide as practical to minimize radiated emissions.
Minimize the length of the trace connected to the BOOT pin and the BOOT capacitor to minimize radiated emissions.
Connect a separate VOUT path to the upper feedback resistor.
Place voltage feedback loop away from the high-voltage switching trace. It is preferable to use ground copper near it as a shield.
The trace connected to the FB node must be as small as possible to avoid noise coupling.
Place components connected to the RT/CLK, FB, COMP and SS/TRK pins as close to the IC as possible and minimize traces connected to these pins to avoid noise coupling.
AGND must be connected to PGND on the PCB. Connect AGND to PGND in a region away from switching currents.