SBVS316B September   2018  – December 2020 TPS7A11

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excellent Transient Response
        1. 7.3.1.1 Global Undervoltage Lockout (UVLO)
      2. 7.3.2 Active Discharge
      3. 7.3.3 Enable Pin
      4. 7.3.4 Sequencing Requirement
      5. 7.3.5 Internal Foldback Current Limit
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Dropout Mode
      3. 7.4.3 Disable Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Load Transient Response
      4. 8.1.4 Dropout Voltage
      5. 8.1.5 Behavior During Transition From Dropout Into Regulation
      6. 8.1.6 Undervoltage Lockout Circuit Operation
      7. 8.1.7 Power Dissipation (PD)
      8. 8.1.8 Estimating Junction Temperature
      9. 8.1.9 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedures
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
      2. 11.1.2 Spice Model
      3. 11.1.3 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

over TJ = –40°C to +125°C, VIN = VOUT(NOM) + 0.5 V, VBIAS = VOUT(NOM) + 1.4 V, IOUT = 1 mA, VEN = 1.0 V, CIN = 2.2 μF, COUT = 2.2 μF, and CBIAS = 0.1 μF ( unless otherwise noted); all typical values are at TJ = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Nominal accuracy TJ = 25°C -0.5 0.5 %
Accuracy over temperature –20°C ≤ TJ ≤ 85, DRV package
VOUT(NOM) + 0.5 V ≤ VIN ≤ 3.3 V,
VOUT(NOM) + 1.4 V ≤ VBIAS ≤ 5.5 V,
1 mA ≤ IOUT ≤ 500 mA		 -1.25 1.25 %
–40°C ≤ TJ ≤ 85, YKA package
VOUT(NOM) + 0.5 V ≤ VIN ≤ 3.3 V,
VOUT(NOM) + 1.4 V ≤ VBIAS ≤ 5.5 V,
1 mA ≤ IOUT ≤ 500 mA		 -1.25 1.25
–40°C ≤ TJ ≤ 125,
VOUT(NOM) + 0.5 V ≤ VIN ≤ 3.3 V,
VOUT(NOM) + 1.4 V ≤ VBIAS ≤ 5.5 V,
1 mA ≤ IOUT ≤ 500 mA		 -1.5 1.5
ΔVOUT / ΔVIN VIN line regulation  VOUT(NOM) + 0.5 V ≤ VIN ≤ 3.3 V 0.001 %/V
ΔVOUT / ΔVBIAS VBIAS line regulation VOUT(NOM) + 1.4 V ≤ VBIAS ≤ 5.5 V 0.03 %/V
ΔVOUT / ΔIOUT Load regulation 0.1 mA ≤ IOUT ≤ 500 mA 0.2 %/A
IQ(BIAS) Bias pin current TJ = 25°C, IOUT = 0 mA 3 6 8 µA
–40°C < TJ < 85°C, IOUT = 0 mA 11
IOUT = 0 mA 14
IOUT = 500 mA 60
IQ(IN) Input pin current(1) TJ = 25°C, IOUT = 0 mA 1.6 2.1 µA
–40°C < TJ < 85°C, IOUT = 0 mA 2.3
IOUT = 0 mA 2.6
IOUT = 500 mA 11
ISHDN(BIAS) VBIAS  shutdown current –40°C < TJ < 85°C,
VIN = 3.3 V, VBIAS = 5.5 V, VEN ≤ 0.4 V		 400 nA
–40°C < TJ < 125°C,
VIN = 3.3 V, VBIAS = 5.5 V, VEN ≤ 0.4 V		 1200
ISHDN(IN) VIN  shutdown current –40°C < TJ < 85°C,
VIN = 3.3 V, VBIAS = 5.5 V, VEN ≤ 0.4 V		 1 µA
–40°C < TJ < 125°C,
VIN = 3.3 V, VBIAS = 5.5 V, VEN ≤ 0.4 V		 3
ICL Output current limit VOUT = 0.9 × VOUT(NOM), YKA Package 625 920 1175 mA
VOUT = 0.9 × VOUT(NOM), DRV Package 700 990 1250
ISC Short circuit current limit VOUT = 0 V 300 mA
VDO(IN) VIN dropout voltage(2) VIN = VOUT(NOM) – 0.1 V, IOUT = 500 mA, YKA package 70 110 mV
VIN = VOUT(NOM) – 0.1 V, IOUT = 500 mA, DRV package 90 140
VDO(BIAS) VBIAS dropout voltage(2) IOUT = 500 mA 0.85 1.2 V
IOUT = 250 mA 0.75 1.0
VIN PSRR VIN power-supply rejection ratio f = 1 kHz,
VOUT = 1.0 V, IOUT = 50 mA		 64 dB
f = 100 kHz, 
VOUT = 1.0 V, IOUT = 50 mA		 37
f = 1 MHz,
VOUT = 1.0 V, IOUT = 50 mA		 31
f = 1.5 MHz,
VOUT = 1.0 V, IOUT = 50 mA		 35
VBIAS PSRR VBIAS power-supply rejection ratio f = 1 kHz,
VOUT = 1.0 V, IOUT = 500 mA		 56 dB
f = 100 kHz,
VOUT = 1.0 V, IOUT = 500 mA		 43
f = 1 MHz,
VOUT = 1.0 V, IOUT = 500 mA		 33
Vn Output voltage noise Bandwidth = 10 Hz to 100 kHz,
VOUT = 1.0 V, IOUT = 50 mA		 93.9 µVRMS
VUVLO(BIAS) Bias supply UVLO VBIAS rising 1.46 1.54 1.63 V
VBIAS falling 1.35 1.44 1.55
VUVLO_HYST(BIAS) Bias supply hysteresis VBIAS hysteresis 80 mV
VUVLO(IN) Input supply UVLO  VIN rising 645 675 710 mV
VIN falling 565 600 640
VUVLO_HYST(IN) Input supply hysteresis VIN hysteresis 75 mV
tSTR Start-up time(3)
 		 525 1200 µs
VHI(EN) EN pin logic high voltage 0.9 V
VLO(EN) EN pin logic low voltage 0.4 V
IEN EN pin current EN = 5.5 V 10 nA
RPULLDOWN Pulldown resistor VBIAS = 3.3 V, P version only 120 Ω
TSD Thermal shutdown temperature Shutdown, temperature rising 160 °C
Reset, temperature falling 145
(1) This is the current flowing from VIN to GND.
(2) Dropout is not measured for VOUT < 1.0 V.
(3) Startup time = time from EN assertion to 0.95 × VOUT(NOM).