SLWS245B May   2014  – February 2017 TRF3722

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Typical Characteristics
      1. 6.6.1 Modulator Output Spectrum
    7. 6.7  Typical Characteristics - Output Power
    8. 6.8  Typical Characteristics - Gain
    9. 6.9  Typical Characteristics - OIP3
    10. 6.10 Typical Characteristics - OIP2
    11. 6.11 Typical Characteristics - OP1dB
    12. 6.12 Typical Characteristics - Noise
    13. 6.13 Typical Characteristics - Unadjusted CF
    14. 6.14 Typical Characteristics - Unadjusted SBS
    15. 6.15 Typical Characteristics - LO Harmonic
    16. 6.16 Typical Characteristics - BB Harmonic
    17. 6.17 Typical Characteristics - RF Output Return Loss
    18. 6.18 Typical Characteristics - PLL/VCO
    19. 6.19 Typical Characteristics - Current Consumption
    20. 6.20 Typical Characteristics - Power Dissipation
  7. Parameter Measurement Information
    1. 7.1 Serial Interface Timing Diagram
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 RF Output
      2. 8.3.2 Baseband Inputs
      3. 8.3.3 LO Output
      4. 8.3.4 PLL Architecture
      5. 8.3.5 External VCO
      6. 8.3.6 Loop Filter
      7. 8.3.7 Lock Detect
    4. 8.4 Device Functional Modes
      1. 8.4.1 Selecting PLL Divider Values
      2. 8.4.2 Setup Example for Integer Mode
      3. 8.4.3 Integer and Fractional Mode Selection
      4. 8.4.4 Selecting the VCO and VCO Frequency Control
    5. 8.5 Register Maps
      1. 8.5.1 Serial interface Register Definition
        1. 8.5.1.1 BIAS SETTINGS
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures: DAC to Modulator Interface Network
      3. 9.2.3 Application Curves: DAC34H84 with TRF3722 Modulator Performance
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.